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Alps Alpine Co., Ltd.Tamura Corp.Asahi Kasei Microdevices Corp.Allegro MicroSystems LLCVACUUMSCHMELZE GmbH & Co. KGVaisala OyjNippon Ceramic Co., Ltd.Crocus Technology, Inc.Instruments, Inc.Pulse Electronics Corp.Sensitec GmbHTelcon Ltd.Sense Labs, Inc.Aceinna, Inc.NEO Monitors ASNEO Monitors ASHoward Butler Ltd.Yost Engineering, Inc.Digi SmartSense LLCSentera, Inc.Systron Donner Inertial, Inc.
Toyota Motor Corp.Honda Motor Co., Ltd.DENSO Corp.Hyundai Motor Co., Ltd.Kia Corp.Mazda Motor Corp.Kobe Steel, Ltd.3M Co.Volkswagen Group of America, Inc.Sumitomo Wiring Systems (U.S.A.), Inc.Aisin Corp.ZF Friedrichshafen AGShowa Denko Materials Co. Ltd.Resonac Corp.Mitsubishi Motors Corp.Goodyear Tire & Rubber Co.Goodyear Tire & Rubber Co.AUDI AGHitachi Metals, Ltd.Toyota Industries Corp.Subaru Corp.The Yokohama Rubber Co., Ltd.The Yokohama Rubber Co., Ltd.BYD Co., Ltd.Subaru Corp.Zhejiang Geely Holding Group Co., Ltd.NGK SPARK PLUG CO., LTD.Toyoda Gosei Co., Ltd.Daihatsu Motor Co., Ltd.Aisin AW Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
Boe Innovation Investment Co. Ltd.Honeywell International, Inc.Thales GroupAlps Alpine Co., Ltd.Raytheon Co.NGK SPARK PLUG CO., LTD.Hamamatsu Photonics KKRaytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.OSRAM Opto Semiconductors GmbHNippon Seiki Co., Ltd.Freescale Semiconductor, Inc.LAPIS Semiconductor Co. Ltd.HELLA GmbH & Co. KGaAAnalog Devices, Inc.DePuy Synthes Products, Inc.Rosemount, Inc.Dr. Johannes Heidenhain GmbHThe Georgia Tech Research Corp.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Furuno Electric Co., Ltd.Novatek Microelectronics Corp.Textron, Inc.Asahi Kasei Microdevices Corp.Meizu Technology Co. Ltd.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.KEYENCE Corp.Weidmüller Interface GmbH & Co. KG
Aceinna, Inc.Fachhochschule Lübeck
SMA Solar Technology AGAgere Systems LLCFidlock GmbHGroupe Guillin SARotron, Inc.SolarWinds North America, Inc.Tissuemed Ltd.Lynk Labs, Inc.SenzaGen ABRedback Networks, Inc.Histogen, Inc.Luidia, Inc.Healthy.io Ltd.Acme Packet, Inc.OneSpin Solutions GmbHUbidyne, Inc.Ubidyne, Inc.Concord Communications LLCIronPort Systems, Inc.Schneder Consumer Group SAHVVi Semiconductors, Inc.Aceinna, Inc.iie GmbH & Co. KGNuclear Safeguards & Security Systems LLCAccent SpAResoimplant GmbHBasic Concepts, Inc.iReady Corp.iReady Corp.Veraz Networks, Inc.
Fujitsu Ltd.Aisin Corp.Japan Display, Inc.Furuno Electric Co., Ltd.Safran SAIsrael Aerospace Industries Ltd.THINKWARE Systems Corp.E-Lead Electronic Co., Ltd.Navitime Japan Co. Ltd.Trimble, Inc.TeleCommunication Systems, Inc.Medtronic Surgical TechnologiesShenzhen Hangsheng Electronics Co., Ltd.Medacta International SAQianxun Spatial Intelligence, Inc.Guangdong Coagent Electronic S&T Co., Ltd.iXBlue SASNovAtel, Inc.Northrop Grumman LITEF GmbHNavico Holding ASShenzhen Roadrover Technology Co., Ltd.Shenzhen Roadrover Technology Co., Ltd.Ant Precision Industry Co. Ltd.Toyota Mapmaster, Inc.Zhengzhou Tiamaes Technology Co., Ltd.Zeni Lite Buoy Co. Ltd.Shaanxi Aerospace Power Hi-Tech Co., Ltd.MicroPort EPAeva, Inc.Saite