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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.Samsung Display Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Boe Innovation Investment Co. Ltd.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.LG Display Co., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Applied Materials, Inc.Micron Technology, Inc.Fraunhofer-Gesellschaft eVShin-Etsu Chemical Co., Ltd.TOPPAN Holdings, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.General Electric Co.General Electric Co.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.FUJIFILM Corp.Apple, Inc.ZTE Corp.Samsung Display Co., Ltd.Hewlett-Packard Development Co.Google LLCEastman Kodak Co.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Oki Electric Industry Co., Ltd.Olympus Corp.Tencent Technology (Shenzhen) Co., Ltd.Motorola, Inc.TDK Corp.Alcatel-Lucent S AToyota Industries Corp.Microsoft Corp.
Taiwan Semiconductor Manufacturing Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Applied Materials, Inc.United Microelectronics Corp.Shinko Electric Industries Co., Ltd.Fujitsu Semiconductor Ltd.Qimonda AGUnimicron Technology Corp.STATS ChipPAC Pte Ltd.ChipMOS Technologies, Inc.Powertech Technology, Inc.JCET Group Co., Ltd.AT & S Austria Technologie & Systemtechnik AGXintec, Inc.King Yuan Electronics Co., Ltd.Chipbond Technology Corp.Amkor Technology, Inc.NEPES Corp.Advanced Chip Engineering Technology, Inc.HANA MICRON, Inc.Camtek Ltd.Niko Semiconductor Co., Ltd.Samsung Semiconductor, Inc.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Micron Technology Taiwan, Inc.Trust Alliance Information Development Inc., Ltd. ShanghaiTrust Alliance Information Development Inc., Ltd. ShanghaiFlipChip International LLC
DENSO Corp.SK hynix, Inc.Taiwan Semiconductor Manufacturing Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Applied Materials, Inc.Micron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Showa Denko Materials Co. Ltd.South China University of TechnologyResonac Corp.Ebara Corp.SCREEN Holdings Co., Ltd.University of Electronic Science & Technology of ChinaAdvanced Micro Devices, Inc.Lam Research Corp.DISCO Corp.KIOXIA Corp.United Microelectronics Corp.Hangzhou Dianzi UniversityULVAC, Inc.JUKI Corp.Macronix International Co., Ltd.Shin-Etsu Handotai Co., Ltd.Realtek Semiconductor Corp.LAPIS Semiconductor Co. Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Microchip Technology, Inc.Fujitsu Semiconductor Ltd.
Hon Hai Precision Industry Co., Ltd.SK hynix, Inc.Taiwan Semiconductor Manufacturing Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Applied Materials, Inc.South China University of TechnologySoutheast UniversityHitachi Kokusai Electric, Inc.Ebara Corp.SCREEN Holdings Co., Ltd.University of Electronic Science & Technology of ChinaLam Research Corp.DISCO Corp.Sony Semiconductor Solutions Corp.United Microelectronics Corp.Advantest Corp.Stanley Electric Co., Ltd.ULVAC, Inc.Macronix International Co., Ltd.Socionext, Inc.TOKYO OHKA KOGYO CO., LTD.KLA Corp.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.National Semiconductor Corp.Fujitsu Semiconductor Ltd.Nanjing University of TechnologyWinbond Electronics Corp.Skyworks Solutions, Inc.DB HITEK Co., Ltd.