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Fujitsu Ltd.OppoMastercard International, Inc.Giesecke+Devrient GmbHShenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Fujitsu Frontech Ltd.Huf Hülsbeck & Fürst GmbH & Co. KGSRI InternationalSAMSUNG SDS CO., LTD.Iflytek Co., Ltd.Taikang Life Insurance Co., Ltd.Maxvision Technology Corp.Crucialtec Co., Ltd.Egis Technology, Inc.Methode Electronics, Inc.Industrial Bank of KoreaTiVo Corp.Leidos, Inc.Bruin Biometrics LLCLeidos Holdings, Inc.Fingerprint Cards ABFaraday&Future, Inc.Smiths Detection LLCPMD Technologies Ltd.U-Shin, Ltd.IDEX Biometrics ASAOXi Technology Co., Ltd.NiCE Ltd.Vocollect, Inc.
The Boeing Co.Goodyear Tire & Rubber Co.Goodyear Tire & Rubber Co.Subaru Corp.Subaru Corp.B/E Aerospace, Inc.Sikorsky Aircraft Corp.Chuo Spring Co., Ltd.Bombardier, Inc.AIRBUS HELICOPTERS DEUTSCHLAND GmbHHANWHA AEROSPACE Co., Ltd.Airbus SERECARO Aircraft Seating GmbH & Co. KGJAMCO Corp.Panasonic Avionics Corp.Hindustan Aeronautics Ltd.Asahi-Seiki Manufacturing Co., Ltd.DaimlerChrysler Aerospace AG /MUNICH/Jack & Heintz Precision Industries, Inc.Aurora Flight Sciences Corp.Kymeta Corp.FACC AGLISI AEROSPACE SASBarnes Group, Inc.Spirit AeroSystems, Inc.Huiyang Aviation Propeller Co., Ltd.Huiyang Aviation Propeller Co., Ltd.L&L Products, Inc.Guangzhou Yihang Intelligence Technology Co. Ltd.EaglePicher Technologies LLC
Boe Innovation Investment Co. Ltd.Honeywell International, Inc.Thales GroupAlps Alpine Co., Ltd.Raytheon Co.NGK SPARK PLUG CO., LTD.Hamamatsu Photonics KKRaytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.OSRAM Opto Semiconductors GmbHNippon Seiki Co., Ltd.Freescale Semiconductor, Inc.LAPIS Semiconductor Co. Ltd.HELLA GmbH & Co. KGaAAnalog Devices, Inc.DePuy Synthes Products, Inc.Rosemount, Inc.Dr. Johannes Heidenhain GmbHThe Georgia Tech Research Corp.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Furuno Electric Co., Ltd.Novatek Microelectronics Corp.Textron, Inc.Asahi Kasei Microdevices Corp.Meizu Technology Co. Ltd.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.KEYENCE Corp.Weidmüller Interface GmbH & Co. KG
General Electric Co.General Electric Co.Japan Aviation Electronics Industry Ltd.SCHOTT AGAlliedSignal, Inc.Eclipse Aviation Corp.Angang Steel Co., Ltd.Pratt & Whitney Canada Corp.NUCTECH Co., Ltd.Textron, Inc.Dürr Systems, Inc.Babcock International Ltd.Rockwell Collins, Inc.Sikorsky Aircraft Corp.AECC Shenyang Liming Aero-Engine Co., Ltd.North American Aviation, Inc.Harmonic Drive Systems, Inc.Bombardier, Inc.FAG Kugelfischer AG & Co. KGAECC South Industry Co., Ltd.AECC Aviation Power Co., Ltd.Showa Aircraft Industry Co., Ltd.AeroVironment, Inc.GE Aviation Systems Ltd.Phillips 66Gulfstream Aerospace Corp.Magang (Group) Holding Co., Ltd.AT & S Austria Technologie & Systemtechnik AGSinopec Yangzi Petrochemical Co., Ltd.Sinopec Yangzi Petrochemical Co., Ltd.
General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.LIG Nex1 Co., Ltd.Raytheon Co.Subaru Corp.Beihang UniversityLucas Industries PlcDaicel Corp.KYB Corp.Hughes Aircraft Co.SZ DJI Technology Co., Ltd.Raytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.Hamilton Sundstrand Corp.AlliedSignal, Inc.Eclipse Aviation Corp.Tektronix, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.United Aircraft Corp.Analog Devices, Inc.Mitsubishi Cable Industries Ltd.Voith GmbH & Co. KGaAMesserschmitt-Boelkow-Blohm GmbHMesserschmitt-Boelkow-Blohm GmbHNorthrop Grumman Systems Corp.Pratt & Whitney Canada Corp.Raychem Corp.
