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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.LIG Nex1 Co., Ltd.Raytheon Co.Subaru Corp.Beihang UniversityLucas Industries PlcDaicel Corp.KYB Corp.Hughes Aircraft Co.SZ DJI Technology Co., Ltd.Raytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.Hamilton Sundstrand Corp.AlliedSignal, Inc.Eclipse Aviation Corp.Tektronix, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.United Aircraft Corp.Analog Devices, Inc.Mitsubishi Cable Industries Ltd.Voith GmbH & Co. KGaAMesserschmitt-Boelkow-Blohm GmbHMesserschmitt-Boelkow-Blohm GmbHNorthrop Grumman Systems Corp.Pratt & Whitney Canada Corp.Raychem Corp.
LG Electronics, Inc.Sharp Corp.Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Electronics & Telecommunications Research InstituteAlcatel-Lucent S ANTT DOCOMO, Inc.Showa Denko Materials Co. Ltd.Western Electric Co., Inc.Fujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyLucent Technologies, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Motorola Solutions, Inc.Tokyo Electric Power Co. Holdings, Inc.Nubia Technology Co., Ltd.Sony Ericsson Mobile Communications AB
Toyota Motor Corp.Honda Motor Co., Ltd.DENSO Corp.Hyundai Motor Co., Ltd.Mazda Motor Corp.Kobe Steel, Ltd.Bayerische Motoren Werke AGVolkswagen Group of America, Inc.Sumitomo Wiring Systems (U.S.A.), Inc.Aisin Corp.ZF Friedrichshafen AGShowa Denko Materials Co. Ltd.Mitsubishi Motors Corp.Goodyear Tire & Rubber Co.Goodyear Tire & Rubber Co.Daewoo Motor Co.Hitachi Metals, Ltd.Proterial Ltd.Toyota Industries Corp.Subaru Corp.The Yokohama Rubber Co., Ltd.The Yokohama Rubber Co., Ltd.BYD Co., Ltd.Subaru Corp.Zhejiang Geely Holding Group Co., Ltd.Zhejiang Geely Holding Group Co., Ltd.NGK SPARK PLUG CO., LTD.Toyoda Gosei Co., Ltd.Lucas Industries PlcHitachi Astemo Ltd.
Nichia Corp.Fujitsu Semiconductor Ltd.Skyworks Solutions, Inc.Dowa Electronics Materials Co., Ltd.Novuton Technology Corp. JapanSumitomo Electric Device Innovations, Inc.GlobalWafers Co., Ltd.MACOM Technology Solutions Holdings, Inc.NTT Advanced Technology Corp.Hitachi Power Semiconductor Device Ltd.RichWave Technology Corp.Xiamen Changelight Co., Ltd.NeoPhotonics Corp.Ampleon Netherlands BVXiamen San'an Integrated Circuit Co., Ltd.TriQuint Semiconductor, Inc.Xiamen San'an Integrated Circuit Co., Ltd.Win Semiconductors Corp.IQE PlcFreiberger Compound Materials GmbHEfficient Power Conversion Corp.Transphorm Technology, Inc.SILTECTRA GmbHPhysical Sciences, Inc.Shanghai Simgui Technology Co., Ltd.Shanghai Simgui Technology Co., Ltd.RFHIC Corp.United Monolithic Semiconductors SASDenseLight Semiconductors Pte Ltd.Avogy, Inc.
Electronics & Telecommunications Research InstituteSemiconductor Energy Laboratory Co., Ltd.South China University of TechnologySoutheast UniversityUniversity of Electronic Science & Technology of ChinaToyoda Gosei Co., Ltd.DISCO Corp.Toyota Central R&D Labs, Inc.Hangzhou Dianzi UniversityNanjing University of Posts & TelecommunicationsOsaka UniversityShin-Etsu Handotai Co., Ltd.Fujitsu Semiconductor Ltd.Nanjing University of TechnologySUMCO Corp.Sanken Electric Co., Ltd.EPISTAR Corp.Soitec SADowa Electronics Materials Co., Ltd.Gwangju Institute of Science & TechnologySeoul Semiconductor Co., Ltd.HRL Laboratories LLCNagoya UniversityIwatsu Electric Co., Ltd.Nisshinbo Micro Devices, Inc.Siltronic AGPower Integrations, Inc.International Rectifier Corp.Semikron Elektronik GmbH & Co. KGNagoya Institute of Technology
SCREEN Holdings Co., Ltd.Lam Research Corp.Mitsubishi Paper Mills Ltd.ULVAC, Inc.Praxair S.T. Technology, Inc.NOF Corp.SEMES Co., Ltd.SUMCO Corp.Sumitomo Electric Hardmetal Ltd.Varian Semiconductor Equipment Associates, Inc.NuFlare Technology, Inc.Canon Anelva Corp.Siltronic AGJUSUNG ENGINEERING Co., Ltd.Novellus Systems, Inc.Advanced Micro Fabrication Equipment, Inc. ChinaAIXTRON SEAdvanced Micro Fabrication Equipment, Inc. ChinaVeeco Instruments, Inc.Mirae Corp.Kateeva, Inc.Zygo Corp.Horiba Stec Co. Ltd.WONIK HOLDINGS CO., LTD.Brewer Science, Inc.Mattson Technology, Inc.GigaLane Co., Ltd.TOCALO Co., Ltd.VON ARDENNE GmbHToray Advanced Film Co., Ltd.