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Advanced Micro Devices, Inc.NVIDIA Corp.Realtek Semiconductor Corp.VIA Technologies, Inc.Cirrus Logic, Inc.Institute For Information IndustryImagination Technologies Ltd.Silicon Laboratories, Inc.Silicon Integrated Systems Corp.Silicon Integrated Systems Corp.ALi Corp.Rockchip Electronics Co., Ltd.LeadCore Technology Co. Ltd.Rockley Photonics Ltd.BitMain Technologies Holding Co.Anyka (Guangzhou) Microelectronics Technology Co., Ltd.Anyka (Guangzhou) Microelectronics Technology Co., Ltd.BitMain Technologies Holding Co.Graphcore Ltd.Volterra Semiconductor Corp.Ingenic Semiconductor Co., Ltd.Ralink Technology Corp.Nan Ya Printed Circuit Board CorpUbiNetics Ltd.SenseTime Group Ltd.Chipintelli Co. Ltd.Flarion Technologies, Inc.Beijing Horizon Robotics Technology Development Co., Ltd.Verisilicon Microelectronics (Shanghai) Co., Ltd.Sequans Communications SA
Intel Corp.3M Innovative Properties Co.Taiwan Semiconductor Manufacturing Co., Ltd.Bayerische Motoren Werke AGJFE Holdings, Inc.Janssen Pharmaceutica NVAdvantest Corp.NIKE, Inc.Chongqing Changan Automobile Co. Ltd.Milliken & Co. (South Carolina)Raychem Corp.Lear Corp.International Paper Co.Varian Semiconductor Equipment Associates, Inc.Delta Faucet Co.Atlas Copco ABBrembo SpAPACCAR, Inc.Crown Equipment Corp.Shanghai Zhenhua Heavy Industries Co., Ltd.Power Integrations, Inc.Wistron NeWeb Corp.Samsung C&T Corp.Hitachi-LG Data Storage, Inc.Jack Technology Co., Ltd.Xiamen Solex High-Tech Industries Co. Ltd.Jack Technology Co., Ltd.Xiamen Solex High-Tech Industries Co. Ltd.HMD Global OyAutodesk, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BV
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
Samsung Electronics Co., Ltd.Sony Group Corp.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Toshiba Chemical Corp.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Midea Group Co. Ltd.Mita Industrial Co., Ltd.
