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LG Electronics, Inc.Sharp Corp.Ericsson, Inc.Nippon Telegraph & Telephone Corp.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Electronics & Telecommunications Research InstituteAlcatel-Lucent S ANTT DOCOMO, Inc.Showa Denko Materials Co. Ltd.Resonac Corp.Western Electric Co., Inc.Fujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyLucent Technologies, Inc.BT Group PlcChina Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.Mannesmann AGJapan Aviation Electronics Industry Ltd.SK Telecom Co., Ltd.BlackBerry Ltd.Nubia Technology Co., Ltd.Nanjing University of Posts & TelecommunicationsKDDI Corp.China United Network Communications Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Sony Group Corp.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AMicrosoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.Beijing Xiaomi Mobile Software Co., Ltd.
Samsung Electronics Co., Ltd.Micron Technology, Inc.MagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Gentex Corp.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.Unity Opto Technology Co., Ltd.Rockley Photonics Ltd.IHP GmbH - Innovations for High Performance MicroelectronicsInvensas Bonding Technologies, Inc.National Chi Nan UniversityFoveon, Inc.MOBOTIX AGAvnera Corp.Tung Thih Electronic Co., Ltd.Skorpios Technologies, Inc.Lightmatter, Inc.Brigates Microelectronics Inc.Tower Semiconductor Ltd.Pixelplus Co., Ltd.Akustica, Inc.AmberWave Systems Corp.MEMSIC, Inc.Sofics BVBASilicon Optronics, Inc.Insiava Pty Ltd.Xiroku, Inc.New Imaging Technologies SADecaWave Ltd.
Moixa Energy Holdings Ltd.
Petronics, Inc.
Alps Alpine Co., Ltd.OSRAM Opto Semiconductors GmbHRosemount, Inc.Dr. Johannes Heidenhain GmbHTakata, Inc.Keihin Corp.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.Key Safety Systems, Inc.Watlow Electric Manufacturing Co.Watlow Electric Manufacturing Co.Draeger Safety, Inc.The Toro Co.InvenSense, Inc.ifm electronic GmbHPreh GmbHPepperl+Fuchs, Inc.Methode Electronics, Inc.BorgWarner Ludwigsburg GmbHInterface, Inc.Casco Products Corp.FIGARO Engineering, Inc.Nippon Ceramic Co., Ltd.Tactual Labs Co.Balluff, Inc.Hanwei Electronics Group Corp.PolyIC GmbH & Co. KGCyberOptics Corp.IDEX Biometrics ASAElmos Semiconductor SE
Sharp Corp.Alps Alpine Co., Ltd.Hamamatsu Photonics KKSony Semiconductor Solutions Corp.Semiconductor Components Industries LLCRosemount, Inc.Dr. Johannes Heidenhain GmbHShenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Novatek Microelectronics Corp.Keihin Corp.Tamagawa Seiki Co., Ltd.Key Safety Systems, Inc.STMicroelectronics International NVWatlow Electric Manufacturing Co.Watlow Electric Manufacturing Co.Draeger Safety, Inc.ELAN Microelectronics Corp.ifm electronic GmbHPreh GmbHCrucialtec Co., Ltd.Pepperl+Fuchs, Inc.Egis Technology, Inc.BorgWarner Ludwigsburg GmbHInterface, Inc.Casco Products Corp.FlexEnable Ltd.FIGARO Engineering, Inc.Nippon Ceramic Co., Ltd.Balluff, Inc.