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Fujikura Ltd.Enplas Corp.Fiberhome Telecommunication Technologies Co., Ltd.AVIC Jonhon Optronic Technology Co., Ltd.AVIC Jonhon Optronic Technology Co., Ltd.Tatsuta Electric Wire & Cable Co., Ltd.Tatsuta Electric Wire & Cable Co., Ltd.ViaSat, Inc.Corning Precision Materials Korea Co., Ltd.Finisar Corp.Finisar Corp.Lumentum Operations LLCJiangsu Zhongtian Technology Co., Ltd.Hengtong Optic-Electric Co., Ltd.OFS Fitel LLCCrucialtec Co., Ltd.Zygo Corp.AFL Telecommunications LLCSENKO Advanced Components, Inc.Xiamen San'an Optoelectronics Technology Co., Ltd.Xiamen San'an Optoelectronics Technology Co., Ltd.Fujitsu Optical Components Ltd.Wuhan Research Institute of Post & Telecommunications Co. Ltd.Guangzhou Haige Communications Group Inc. Co.Guangzhou Haige Communications Group Inc. Co.Osaki Electric Co., Ltd.Thorlabs, Inc.Chaozhou Three-Circle (Group) Co., Ltd.Chaozhou Three-Circle (Group) Co., Ltd.Kinik Co.
International Business Machines Corp.Fujitsu Ltd.Eastman Kodak Co.Google LLC3M Co.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Beijing Xiaomi Mobile Software Co., Ltd.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Deutsche Telekom AGAdobe, Inc.Gemalto, Inc.Sega Group Corp.Beijing Jingdong Shangke Information Technology Co., Ltd.Beijing Jingdong Shangke Information Technology Co., Ltd.Orion Co., Ltd.LEGO A/SLEGO A/SVMware, Inc.NetEase (Hangzhou) Network Co., Ltd.Altera Corp.SK Planet Co., Ltd.Avaya, Inc.HGST, Inc.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.Nuance Communications, Inc.Sandvik AktiebolagCA Technologies, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Sony Group Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.
Samsung Electronics Co., Ltd.Sony Group Corp.OppoMicron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Hamamatsu Photonics KKSony Semiconductor Solutions Corp.Semiconductor Components Industries LLCMagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Cypress Semiconductor Corp.PixArt Imaging, Inc.LARGAN Precision Co., Ltd.Novuton Technology Corp. JapanSTMicroelectronics International NVIEE International Electronics & Engineering SABYD Semiconductor Co., Ltd.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.FUJIFILM Electronic Materials USA, Inc.OFILM Group Co., Ltd.VisEra Technologies Co., Ltd.FlexEnable Ltd.PolyIC GmbH & Co. KGTeledyne Scientific & Imaging LLCISORG SAInvensas Bonding Technologies, Inc.PMD Technologies Ltd.SEKONIX Co., Ltd.SiliconFile Technologies, Inc.
Honeywell International, Inc.Yazaki Corp.Mitsubishi Motors Corp.FANUC Corp.Toyota Industries Corp.Yokogawa Electric Corp.YASKAWA Electric Corp.Magic Leap, Inc.Nachi-Fujikoshi Corp.KEYENCE Corp.Denso Wave, Inc.Jungheinrich AGBaker Perkins Ltd.Reliance Electric Ltd.Dassault Systèmes SAM-System Co., Ltd.Cognex Corp.Hypertherm Associates, Inc.Auris Health, Inc.The Raymond Corp.TECO Electric & Machinery Co., Ltd.Kehua Data Co., Ltd.Kollmorgen Corp.Hunan Chinasun Pharmaceutical Machinery Co., Ltd.TECO Electric & Machinery Co., Ltd.Hunan Chinasun Pharmaceutical Machinery Co., Ltd.Beckhoff Automation GmbH & Co. KGNingbo Cixing Co., Ltd.Shenzhen Inovance Technology Co., Ltd.Koyo Electronics Industries Co., Ltd.