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telent Ltd.Taiyo Yuden Co., Ltd.Advanced International Multitech Co. Ltd.Insta GmbHTime Domain Corp.Haystack Technologies, Inc.Mojix, Inc.KERLINK SAPolte Corp.DecaWave Ltd.AeroScout LLCXtremeSpectrum, Inc.Traxens SAS5d Robotics, Inc.Artimi Ltd.Alereon, Inc.Holux Technology, Inc.Afimilk - Agricultural Cooperative Ltd.Red Point Positioning Corp.Halfwave ASSigma Designs, Inc.WISER Systems, Inc.Cedar Ridge Research LLCWisair Ltd.Wisair Ltd.KLATU Networks, Inc.GiPSTech SRLFleet Space Technologies Pty Ltd.Physical Devices, Inc.Allflex UK Ltd.
Hon Hai Precision Industry Co., Ltd.Sonos, Inc.Nordic Semiconductor ASAJMA LLCEnOcean GmbHVIZIO, Inc.Taoglas Ltd.Espressif Systems (Shanghai) Co., Ltd.Espressif Systems (Shanghai) Co., Ltd.Newracom, Inc.Queclink Wireless Solutions Co., Ltd.RF Monolithics, Inc.Queclink Wireless Solutions Co., Ltd.Arlo Technologies, Inc.Sequans Communications SAEagleView Technologies, Inc.Option NVON Semiconductor Connectivity Solutions, Inc.NEXCOM International Co., Ltd.Wirepas OyMerrimac Industries, Inc.ETS-Lindgren, Inc.GainSpan Corp.Newport Media, Inc.Artimi Ltd.Pepex Biomedical, Inc.Synapse Wireless, Inc.Forkbeard TechnologiesSource Photonics, Inc.iDevices LLC
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVAGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.