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Harman International Industries, Inc.EM Microelectronic-Marin SARGB Systems, Inc.Aehr Test SystemsObjectVideo, Inc.QSC LLCPixelplus Co., Ltd.InteraXon, Inc.Magellan Systems Japan, Inc.Digital Signal Corp.Lake Technology Ltd.Digital:Convergence CorporationBOPS, Inc.JAZiO, Inc.Abaco Systems Ltd.Quickfilter Technologies, Inc.EqcoLogic NVTheseus Logic, Inc.Actiwave ABVirtualLogix, Inc.Intersect Technologies, Inc.Santronics, Inc.Power Tagging Technologies, Inc.Axiocom, Inc.ADM, Inc.Texas Instruments Incorporated
LG Electronics, Inc.Sharp Corp.Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Oki Electric Industry Co., Ltd.Alcatel-Lucent S ANTT DOCOMO, Inc.Showa Denko Materials Co. Ltd.Resonac Corp.Western Electric Co., Inc.Fujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyLucent Technologies, Inc.BT Group PlcChina Mobile Communications Group Co., Ltd.telent Ltd.Mannesmann AGJapan Aviation Electronics Industry Ltd.SK Telecom Co., Ltd.BlackBerry Ltd.Motorola Solutions, Inc.Tokyo Electric Power Co. Holdings, Inc.Nubia Technology Co., Ltd.
Marvell Asia Pte Ltd.Analog Devices, Inc.Harman International Industries, Inc.Cirrus Logic, Inc.dSPACE GmbHTula Technology, Inc.RGB Systems, Inc.GCT Semiconductor, Inc.Zoran Corp.Aehr Test SystemsObjectVideo, Inc.Andrea Electronics Corp.Trex Enterprises Corp.BrainScope Co., Inc.Cruise Munich GmbHAmati Communications Corp.Amati Communications Corp.Innovationszentrum für Telekommunikationstechnik GmbH IZTLake Technology Ltd.DeTect, Inc.LOGIC Devices, Inc.BOPS, Inc.Vubiq, Inc.Zaram Technology Co., Ltd.Quantum Machines Ltd.MuseAmi, Inc.Broadband Innovations, Inc.Wolfson Dynamic Hearing Pty Ltd.Acuant, Inc.Compact Imaging INC
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.