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Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.China Telecom Corp. Ltd.
LG Electronics, Inc.Sharp Corp.Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Electronics & Telecommunications Research InstituteAlcatel-Lucent S ANTT DOCOMO, Inc.Showa Denko Materials Co. Ltd.Western Electric Co., Inc.Fujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyLucent Technologies, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Motorola Solutions, Inc.Tokyo Electric Power Co. Holdings, Inc.Nubia Technology Co., Ltd.Sony Ericsson Mobile Communications AB
Hon Hai Precision Industry Co., Ltd.Sonos, Inc.Nordic Semiconductor ASAJMA LLCEnOcean GmbHVIZIO, Inc.Taoglas Ltd.Espressif Systems (Shanghai) Co., Ltd.Espressif Systems (Shanghai) Co., Ltd.Newracom, Inc.Queclink Wireless Solutions Co., Ltd.RF Monolithics, Inc.Queclink Wireless Solutions Co., Ltd.Arlo Technologies, Inc.Sequans Communications SAEagleView Technologies, Inc.Option NVON Semiconductor Connectivity Solutions, Inc.Wirepas OyNEXCOM International Co., Ltd.Merrimac Industries, Inc.ETS-Lindgren, Inc.GainSpan Corp.Newport Media, Inc.Pepex Biomedical, Inc.Artimi Ltd.Forkbeard TechnologiesSource Photonics, Inc.iDevices LLCStrix Systems, Inc.
National Semiconductor Corp.Atmel Corp.AVIC Jonhon Optronic Technology Co., Ltd.AVIC Jonhon Optronic Technology Co., Ltd.Qorvo US, Inc.Novuton Technology Corp. JapanSilicon Storage Technology, Inc.KMW, Inc.Anhui Tatfook Technology Co., Ltd.Nations Technologies, Inc.Tongyu Communication, Inc.Tongding Interconnection Information Co., Ltd.MaxLinear, Inc.GigaLane Co., Ltd.PARTRON Co., Ltd.DEXIN Corp.RichWave Technology Corp.E-TEN Information Systems Co., Ltd.INPAQ Technology Co., Ltd.NEW POWER PLASMA Co., Ltd.RF360 Europe GmbHCognitive Systems Corp.EZconn Corp.Wuhan Fingu Electronic Technology Co., Ltd.Jiangsu Hengxin Technology Co., Ltd.Officine di Cartigliano SpAWuhan Fingu Electronic Technology Co., Ltd.Jiangsu Hengxin Technology Co., Ltd.Resonant, Inc.ISCO International, Inc.
Toyota Motor Corp.Huawei Technologies Co., Ltd.Apple, Inc.NTT DOCOMO, Inc.Fujikura Ltd.BlackBerry Ltd.Motorola Solutions, Inc.KDDI Corp.China United Network Communications Ltd.Motorola Mobility LLCNintendo Co., Ltd.Motorola Solutions Credit Co. LLCOrange SAGoerTek Inc.Deutsche Telekom AGChina Telecom Corp. Ltd.Toyo Ink SC Holdings Co. Ltd.Giesecke+Devrient GmbHWalmart LabsLear Corp.Skyworks Solutions, Inc.Chunghwa Picture Tubes Ltd.Nanya Technology Corp.Shenzhen Royole Technologies Co., Ltd.LG Uplus Corp.Meizu Technology Co. Ltd.Snap, Inc.Bull SAXiamen Tianma Microelectronics Co., Ltd.Xiamen Tianma Microelectronics Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.
