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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AMicrosoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.Beijing Xiaomi Mobile Software Co., Ltd.
Arbor Networks, Inc.Chengdu Neusoft UniversitySPARTA, Inc.BlueCat Networks, Inc.Tufin Software Technologies Ltd.Objective Systems Integrators, Inc.Skybox Security, Inc.Forward Networks, Inc.NetQoS, Inc.Osprey Pharmaceuticals Ltd.B.Yond, Inc.Coolanyp LLC
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Sony Group Corp.LG Electronics, Inc.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Konica Minolta, Inc.
Fujitsu Ltd.Hewlett-Packard Development Co.Daewoo Electronics Co. Ltd.Lenovo (Beijing) Co., Ltd.Sea Chief Supply Co. Ltd.Makita Corp.ASUSTek Computer, Inc.HKC Corp. Ltd.Julius Blum & Co., Inc.Inspur Electronic Information Industry Co., Ltd.Canon Electronics, Inc.Emhart Industries, Inc.Emhart Industries, Inc.Digital Equipment Corp.Peking University Founder Group Corp.Paul Hettich GmbH & Co. KGSugatsune Kogyo Co., Ltd.Peking University Founder Group Corp.Autoliv ASP, Inc.Inventec (Pudong) Technology Corp.Inventec (Pudong) Technology Corp.Bunker Ramo Corp.ServiceNow, Inc.Miwa Lock Co., Ltd.U-Shin France SASAssa Abloy Ltd.Fujitsu Client Computing Ltd.Aug. Winkhaus GmbH & Co. KGCompaq Computer Corp.Compaq Computer Corp.
MoSys, Inc.EmbedWay Technologies (Shanghai) Corp.Sysmate Co. Ltd.NovaSparks SA
Intel Corp.3M Innovative Properties Co.Taiwan Semiconductor Manufacturing Co., Ltd.Bayerische Motoren Werke AGJFE Holdings, Inc.Advantest Corp.NIKE, Inc.Chongqing Changan Automobile Co. Ltd.Milliken & Co. (South Carolina)Raychem Corp.Lear Corp.International Paper Co.Cypress Semiconductor Corp.Varian Semiconductor Equipment Associates, Inc.Delta Faucet Co.Atlas Copco ABBrembo SpAShanghai Zhenhua Heavy Industries Co., Ltd.Power Integrations, Inc.Wistron NeWeb Corp.Samsung C&T Corp.Hitachi-LG Data Storage, Inc.Jack Technology Co., Ltd.Xiamen Solex High-Tech Industries Co. Ltd.Jack Technology Co., Ltd.Xiamen Solex High-Tech Industries Co. Ltd.HMD Global OyAutodesk, Inc.FARO Technologies, Inc.Dassault Systèmes SA