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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVAGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
Swatch AGInternational Paper Co.Graphic Packaging International LLCBall Corp.MULTIVAC Sepp Haggenmüller SE & Co. KGEM Microelectronic-Marin SAFuji Machinery Co., Ltd.Sonoco Products Co.Bemis Co., Inc.Pactiv LLCChipbond Technology Corp.Bischof + Klein GmbH & Co. KGBerry Global, Inc.Guala Closures SpAPackaging Corporation of AmericaKweichow Moutai Co., Ltd.Aetna Group SpAViscofán SAScribos GmbHLifecore Biomedical, Inc.PiTA - Printed Technology Assets GmbHPiTA - Printed Technology Assets GmbHAnchor Packaging LLCTatwah Smartech Co., Ltd.Intellisync Corp.Genpak LLCAlkar-RapidPak, Inc.Carsem (M) Sdn. Bhd.Novipax, Inc.American Packaging Corp.
LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.E.I. du Pont de Nemours & Co.EIDP, Inc.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.Electronics & Telecommunications Research InstituteMita Industrial Co., Ltd.The Dow Chemical Co.Guangzhou Bosma Optoelectronic Technology Co. Ltd.
3M Innovative Properties Co.Taiwan Semiconductor Manufacturing Co., Ltd.Bayerische Motoren Werke AGJFE Holdings, Inc.Janssen Pharmaceutica NVAdvantest Corp.NIKE, Inc.Chongqing Changan Automobile Co. Ltd.Milliken & Co. (South Carolina)Raychem Corp.Lear Corp.International Paper Co.Cypress Semiconductor Corp.Varian Semiconductor Equipment Associates, Inc.Delta Faucet Co.Atlas Copco ABBrembo SpAPACCAR, Inc.Crown Equipment Corp.Shanghai Zhenhua Heavy Industries Co., Ltd.Power Integrations, Inc.Wistron NeWeb Corp.Samsung C&T Corp.Hitachi-LG Data Storage, Inc.Jack Technology Co., Ltd.Xiamen Solex High-Tech Industries Co. Ltd.Jack Technology Co., Ltd.Xiamen Solex High-Tech Industries Co. Ltd.Autodesk, Inc.FARO Technologies, Inc.
Sanden Corp.Hanon SystemsBabcock Hitachi KKNippon Light Metal Co., Ltd.Rittal GmbH & Co. KGModine Manufacturing Co.Bharat Heavy Electricals Ltd.Zhejiang Sanhua Intelligent Controls Co., Ltd.T. RAD Co., Ltd.Zhejiang Sanhua Intelligent Controls Co., Ltd.Westinghouse Air Brake Technologies Corp.Hisaka Works Ltd.Harbin Boiler Co., Ltd.MAHLE GmbHGTI EnergyShowa Manufacturing Co., Ltd.Baltimore Aircoil Co.HOKKAI CAN Co., Ltd.Sasakura Engineering Co., Ltd.Marelli Corp.Zhejiang Dun'an Artificial Environment Co., Ltd.Deutsche Babcock AGMarelli Corp.Panasonic Ecology Systems Guangdong Co. Ltd.Zhejiang Hailiang Co. Ltd.Denso Thermal Systems SpAWuxi Huaguang Environment & Energy Group Co., Ltd.Hangzhou Sanhua Micro Channel Heat Exchanger Co., Ltd.Ormat Technologies, Inc.Zhejiang Yinlun Machinery Co., Ltd.
Sumitomo Bakelite Co., Ltd.MRSI Systems LLCSmall Precision Tools, Inc.F&S Bondtec Semiconductor GmbH
Taiwan Semiconductor Manufacturing Co., Ltd.SEMES Co., Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Tokyo Seimitsu Co., Ltd.Siliconware Precision Industries Co., Ltd.MKS Instruments, Inc.STATS ChipPAC Pte Ltd.MPI Corp.Powertech Technology, Inc.JCET Group Co., Ltd.Namics Corp.AT & S Austria Technologie & Systemtechnik AGTongFu Microelectronics Co., Ltd.Xintec, Inc.JAPAN ELECTRONIC MATERIALS CORP.JAPAN ELECTRONIC MATERIALS CORP.Chipbond Technology Corp.Amkor Technology, Inc.NEPES Corp.Walton Advanced Engineering, Inc.Subtron Technology Co., Ltd.Foshan Nationstar Semiconductor Co., Ltd.Lingsen Precision Industries Ltd.Kinsus Interconnect Technology Corp.Samsung Semiconductor, Inc.FINETECH GmbH & Co. KG3D Plus SASTianshui Huatian Technology Co., Ltd.