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telent Ltd.Motorola Solutions, Inc.Orange SATridonic GmbH & Co. KGKing Abdullah University of Science & TechnologySTMicroelectronics International NVTYK Corp.Aichi Tokei Denki Co., Ltd.Nordic Semiconductor ASAAzbil Kimmon Co., Ltd.Advanced International Multitech Co. Ltd.Baumüller Nürnberg GmbHImpinj, Inc.Xicato, Inc.Breitling SAMisumi Corp.Blackhawk Network, Inc.Aeris Communications, Inc.Apator SATeleTracking Technologies, Inc.Nanotron Technologies GmbHSanta & Cole Neoseries SLHaystack Technologies, Inc.Mojix, Inc.Blaze Bioscience, Inc.Polte Corp.DecaWave Ltd.AeroScout LLCCenTrak, Inc.Beacon Lighting International Ltd.
Daimler-Benz Aerospace AGFried. Krupp GmbHGebrueder SulzerNippon Steel Nisshin Co., Ltd.LIXIL Corp. /Old/Koenig & Bauer AGKoenig & Bauer AGTaiheiyo Cement Corp.Snamprogetti SpAKennametal, Inc.China Construction Eighth Engineering Division Corp. Ltd.China Construction Second Engineering Bureau Co., Ltd.United States Gypsum Co.China Railway Siyuan Survey & Design Group Co., Ltd.United States Gypsum Co.Combustion Engineering, Inc.Primetals Asset Management U.K. Ltd.Saint-Gobain TM KKAlbemarle Corp.Paul Wurth SAJohns Manville Corp.Powerchina Huadong Engineering Corp. Ltd.Powerchina Huadong Engineering Corp. Ltd.Shanghai Baoye Group Co., Ltd.Graco, Inc.China Construction Seventh Engineering Division Corp. Ltd.SMS group GmbHKorea Institute of Construction TechnologyThe First Co. of China Eighth Engineering Bureau Ltd.RHI Magnesita Deutschland AG