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Intel Corp.Seagate Technology LLCHGST, Inc.Universal Display Corp.KIOXIA Corp.Fujitsu Component Ltd.LSI Corp.Methode Electronics, Inc.ADATA Technology Co., Ltd.Bridgelux, Inc.Ostendo Technologies, Inc.Raytheon Canada Ltd.Benewake (Beijing) Co. Ltd.Benewake (Beijing) Co. Ltd.Biwin Storage Technology Co., Ltd.Beijing WeLion New Energy Technology Co. Ltd.Xiamen Hongfa Electroacoustic Co., Ltd.Tesat Spacecom GmbH & Co. KGBeijing WeLion New Energy Technology Co. Ltd.Inno Laser Technology Co., Ltd.Thermatool Corp.Luminus Devices, Inc.Viking Technology, Inc.Phononic, Inc.Optatech OySolid State System Co., Ltd.Cooledge Lighting, Inc.TeraDiode, Inc.Ledlink Optics, Inc.Futurepath Technology (Shenzhen) Co., Ltd.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Toppan, Inc.Konica Minolta, Inc.
Canon, Inc.Ricoh Co., Ltd.Ricoh Co., Ltd.Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Casio Computer Co., Ltd.Fraunhofer-Gesellschaft eVOlympus Corp.Hamamatsu Photonics KKDISCO Corp.Koito Manufacturing Co., Ltd.Minolta Co., Ltd.OSRAM Opto Semiconductors GmbHNichia Corp.JSWKennametal, Inc.Hisense Visual Technology Co., Ltd.Polyplastics Co., Ltd.Lite-On Technology Corp.Han's Laser Technology Industry Group Co., Ltd.Han's Laser Technology Industry Group Co., Ltd.Optoma Corp.Waymo LLCCanon Marketing Japan, Inc.Shibuya Corp.Gwangju Institute of Science & TechnologyKEYENCE Corp.Leica Geosystems AGShandong Normal UniversityMKS Instruments, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
Fraunhofer-Gesellschaft eVFujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.Hamamatsu Photonics KKChina University of Petroleum (East China)China University of Petroleum (East China)OSRAM Opto Semiconductors GmbHHIROSE ELECTRIC CO., LTD.Tamura Corp.Lawrence Livermore National LaboratoryPolitechnika WroclawskaDe la Rue International Ltd.MKS Instruments, Inc.Tatsuta Electric Wire & Cable Co., Ltd.Tatsuta Electric Wire & Cable Co., Ltd.iconectiv LLCHisense Broadband Multimedia Technologies Co., Ltd.Seikoh Giken Co., Ltd.Hisense Broadband Multimedia Technologies Co., Ltd.Toshiba Materials Co., Ltd.NTT Electronics Corp.Finisar Corp.Finisar Corp.MPI Corp.Lumentum Operations LLCMellanox Technologies Ltd.OFS Fitel LLCPreformed Line Products Co.BIONEER Corp.
