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Toyota Motor Corp.Seiko Epson Corp.Honda Motor Co., Ltd.DENSO Corp.Midea Group Co. Ltd.FANUC Corp.Iseki & Co., Ltd.Thales SAHilti AGYASKAWA Electric Corp.SZ DJI Technology Co., Ltd.Hanwha Ocean Co., Ltd.NVIDIA Corp.JD.com, Inc.Miele & Cie. KGDana-Farber Cancer Institute, Inc.Tianjin Electric Power Corp.AMAZONEN-WERKE H. DREYER SE & Co. KGLEGO A/SNabtesco Corp.Haldor Topse A/SLEGO A/SAlfred Kärcher SE & Co. KGParker-Hannifin Corp.National Aeronautics & Space AdministrationThe Shenzhen Institutes of Advanced TechnologyWaymo LLCRenishaw PlcRyobi Ltd.Shibuya Corp.
Toyota Motor Corp.Honda Motor Co., Ltd.FANUC Corp.YASKAWA Electric Corp.Tianjin Electric Power Corp.LEGO A/SLEGO A/SAlfred Kärcher SE & Co. KGShenyang Institute of AutomationNachi-Fujikoshi Corp.Denso Wave, Inc.Hydro-QuébeciRobot Corp.Ecovacs Robotics Co., Ltd.SIASUN Robot & Automation CO., Ltd.Comau SpACanny Elevator Co., Ltd.Hasbro, Inc.Auris Health, Inc.MAKO Surgical Corp.Maxvision Technology Corp.Parrot SAJ. Schmalz GmbHHayward Industries, Inc.Shibuya Seiki Co., Ltd.Verb Surgical, Inc.Keenon Robotics Co. Ltd.Beijing Zhixingzhe Technology Co. Ltd.FRANKA EMIKA GmbHBoston Dynamics, Inc.
Fujitsu Ltd.Harbin Institute of TechnologyMastercard International, Inc.Giesecke+Devrient GmbHShenzhen Goodix Technology Co., Ltd.PayPal, Inc.Huf Hülsbeck & Fürst GmbH & Co. KGFujitsu Frontech Ltd.National Taiwan UniversitySharkNinja Operating LLCNational Cheng Kung UniversityIflytek Co., Ltd.Synaptics, Inc.Safran SANational Taiwan University of Science & TechnologyX Corp. (United States)National Central UniversityNational Central UniversityBeijing Minglue Software System Ltd.National Pingtung University of Science & TechnologyEgis Technology, Inc.Industrial Bank of KoreaBitMain Technologies Holding Co.Bruin Biometrics LLCShenzhen Zhuiyi Technology Co., Ltd.Shenzhen Zhuiyi Technology Co., Ltd.BitMain Technologies Holding Co.Graphcore Ltd.Cognitive Systems Corp.Impinj, Inc.
Samsung Electronics Co., Ltd.Intel Corp.Apple, Inc.Hon Hai Precision Industry Co., Ltd.SK hynix, Inc.Google LLCNTT DOCOMO, Inc.South China University of TechnologyMicrosoft Corp.Industrial Technology Research InstituteShanghai Jiao Tong UniversityZhejiang University of TechnologyMinolta Co., Ltd.Harbin Institute of TechnologyUniversity of Electronic Science & Technology of ChinaMediaTek, Inc.Beihang UniversityKunming University of Science & TechnologyWuhan UniversityAdvanced Micro Devices, Inc.Inventec Corp.Tongji UniversityBeijing Institute of TechnologyMeta Platforms, Inc.Zhejiang Sci-Tech UniversitySouthwest Jiaotong UniversityHarbin University of Science & TechnologySK Telecom Co., Ltd.Wisconsin Alumni Research FoundationNational University of Defense Technology
Toyota Motor Corp.Seiko Epson Corp.Honda Motor Co., Ltd.DENSO Corp.Midea Group Co. Ltd.FANUC Corp.Iseki & Co., Ltd.Thales SAYASKAWA Electric Corp.SZ DJI Technology Co., Ltd.JD.com, Inc.Miele & Cie. KGTianjin Electric Power Corp.AMAZONEN-WERKE H. DREYER SE & Co. KGLEGO A/SNabtesco Corp.Bando Chemical Industries Ltd.LEGO A/SAlfred Kärcher SE & Co. KGParker-Hannifin Corp.National Aeronautics & Space AdministrationQinetiQ Ltd.The Shenzhen Institutes of Advanced TechnologyRenishaw PlcConti Temic Microelectronic GmbHShenyang Institute of AutomationShibuya Corp.Nitto Kohki Co., Ltd.Nachi-Fujikoshi Corp.Bozhon Precision Industry Technology Co., Ltd.
Boe Innovation Investment Co. Ltd.Honeywell International, Inc.TDK Corp.Thales GroupAlps Alpine Co., Ltd.Niterra Co., Ltd.Thales SAHamamatsu Photonics KKGoodrich Corp.Japan Aviation Electronics Industry Ltd.OSRAM Opto Semiconductors GmbHNippon Seiki Co., Ltd.Freescale Semiconductor, Inc.HELLA GmbH & Co. KGaARTX Corp.LAPIS Semiconductor Co. Ltd.DePuy Synthes Products, Inc.Microchip Technology, Inc.Nabtesco Corp.The Georgia Tech Research Corp.TDK Electronics AGParker-Hannifin Corp.Shenzhen Goodix Technology Co., Ltd.Furuno Electric Co., Ltd.Novatek Microelectronics Corp.Conti Temic Microelectronic GmbHTextron, Inc.Asahi Kasei Microdevices Corp.Meizu Technology Co. Ltd.PixArt Imaging, Inc.