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Intel Corp.Seagate Technology LLCHGST, Inc.Universal Display Corp.KIOXIA Corp.Fujitsu Component Ltd.LSI Corp.Methode Electronics, Inc.ADATA Technology Co., Ltd.Bridgelux, Inc.Ostendo Technologies, Inc.Raytheon Canada Ltd.Benewake (Beijing) Co. Ltd.Metalysis Ltd.Benewake (Beijing) Co. Ltd.Avalanche Technology, Inc.Biwin Storage Technology Co., Ltd.Beijing WeLion New Energy Technology Co. Ltd.Xiamen Hongfa Electroacoustic Co., Ltd.Tesat Spacecom GmbH & Co. KGBeijing WeLion New Energy Technology Co. Ltd.Inno Laser Technology Co., Ltd.Viking Technology, Inc.Phononic, Inc.Optatech OySolid State System Co., Ltd.Geomatec Co., Ltd.TeraDiode, Inc.Ledlink Optics, Inc.Futurepath Technology (Shenzhen) Co., Ltd.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.