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Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Chery Automobile Co., Ltd.Waymo LLCLeica Geosystems AGLeica Geosystems AGNovuton Technology Corp. JapanTrimble Navigation Ltd.FARO Technologies, Inc.Agere Systems LLCZoox, Inc.Nanjing Panda Electronics Co. Ltd.Kuban University of TechnologyNanjing Panda Electronics Co. Ltd.Hitachi-LG Data Storage Korea, Inc.VanJee Technology Co., Ltd.Trimble, Inc.Shanghai Hesai Technology Co., LtdShenzhen Suteng Innovation Technology Co., Ltd.Avanex Corp.Argo AI LLCShenzhen LeiShen Intelligent System Co., Ltd.Hokuyo Automatic Co. Ltd.Zhejiang Crystal-optech Co., Ltd.ADC Automotive Distance Control Systems GmbHMicrochip Technology Caldicot Ltd.Benewake (Beijing) Co. Ltd.Benewake (Beijing) Co. Ltd.Ibeo Automotive Systems GmbHRIEGL Laser Measurement Systems GmbH
Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
Maxphotonics Co., Ltd.HBL Corp.StarMedTec GmbH
Ricoh Co., Ltd.Ricoh Co., Ltd.Hewlett-Packard Development Co.Eastman Kodak Co.Dai Nippon Printing Co., Ltd.Konica Minolta, Inc.Massachusetts Institute of TechnologyNGK SPARK PLUG CO., LTD.Mitsubishi Paper Mills Ltd.Kennametal, Inc.Unisys Corp.Tokyo Seimitsu Co., Ltd.Waymo LLCLenzing AGSMS group GmbHSandvik AktiebolagManroland Sheetfed GmbHMimaki Engineering Co., Ltd.Hoeganaes Corp.Align Technology, Inc.Draper, Inc.IDEC Corp.Greatbatch Ltd.Widex A/SWidex A/S3D Systems, Inc.Autodesk, Inc.Yamazaki Mazak Corp.FARO Technologies, Inc.H.C. Starck, Inc.
Toyota Motor Corp.Seiko Epson Corp.Honda Motor Co., Ltd.DENSO Corp.Midea Group Co. Ltd.FANUC Corp.Iseki & Co., Ltd.Hilti AGYASKAWA Electric Corp.SZ DJI Technology Co., Ltd.DAEWOO SHIPBUILDING & MARINE ENGINEERING Co., Ltd.NVIDIA Corp.JD.com, Inc.Miele & Cie. KGDana-Farber Cancer Institute, Inc.Mattel, Inc.Husqvarna ABLEGO A/SHaldor Topse A/SLEGO A/SNational Aeronautics & Space AdministrationThe Shenzhen Institutes of Advanced TechnologyThe Shenzhen Institutes of Advanced TechnologyWaymo LLCSRI InternationalRyobi Ltd.Shibuya Corp.Tatsuno Corp.Nachi-Fujikoshi Corp.Bozhon Precision Industry Technology Co., Ltd.
Canon, Inc.Ricoh Co., Ltd.Ricoh Co., Ltd.Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Casio Computer Co., Ltd.Fraunhofer-Gesellschaft eVOlympus Corp.Hamamatsu Photonics KKKoito Manufacturing Co., Ltd.Minolta Co., Ltd.Nichia Corp.JSWKennametal, Inc.Hisense Visual Technology Co., Ltd.Polyplastics Co., Ltd.Lite-On Technology Corp.Han's Laser Technology Industry Group Co., Ltd.Han's Laser Technology Industry Group Co., Ltd.Optoma Corp.Waymo LLCCanon Marketing Japan, Inc.Shibuya Corp.Gwangju Institute of Science & TechnologyKEYENCE Corp.Leica Geosystems AGShandong Normal UniversityMKS Instruments, Inc.Appotronics Corp. Ltd.Electro Scientific Industries, Inc.