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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.
Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.BT Group PlcChina Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.China Telecom Corp. Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd.Shin-Etsu Chemical Co., Ltd.Shin-Etsu Handotai Co., Ltd.Angang Steel Co., Ltd.Shin-Etsu Polymer Co., Ltd.Wuhan Iron & Steel Co., Ltd.Soitec SAWuhan Iron & Steel Group Corp.Fujimi, Inc.Elpida Memory, Inc.Siltronic AGPrimetals Technologies Austria GmbHElkem ASAElectro Scientific Industries, Inc.Silicon Laboratories, Inc.AIXTRON SENippon Steel & Sumikin Coated Sheet Corp.Inner Mongolia Baotou Steel Union Co. Ltd.Hirata Corp.LX Semicon Co., Ltd.GlobalWafers Co., Ltd.eMemory Technology, Inc.Silicon Integrated Systems Corp.Silicon Integrated Systems Corp.Faraday Technology Corp.Fujian Longking Co., Ltd.OSAKA Titanium Technologies Co., Ltd.GigaLane Co., Ltd.Anshan Iron & Steel Group Corp.Fujikoshi Machinery Corp.
Metalink Ltd.Broadband United GmbHMitraStar Technology Corp.
QUALCOMM, Inc.Ericsson, Inc.BT Group PlcDatang Mobile Communications Equipment Co. Ltd.Taiyo Yuden Co., Ltd.Bose Corp.Hyundai WIA Corp.SoftBank Corp.ViaSat, Inc.Wistron NeWeb Corp.Hisense Group Co., Ltd.Sagemcom Broadband SASRosenberger Hochfrequenztechnik GmbH & Co. KGSagemcom Broadband SASSilicon Laboratories, Inc.CETC Potevio Science & Technology Co., Ltd.The MathWorks, Inc.Shanghai Zenmen Technology Co. Ltd.Askey Computer Corp.Faraday Technology Corp.Arcadyan Technology Corp.TP-LINK Technologies Co., Ltd.Parrot SAALAXALA Networks Corp.Wuhan Research Institute of Post & Telecommunications Co. Ltd.VoiceAge Corp.Shakespeare Co. LLCParallel Wireless, Inc.Rearden LLCNETGEAR, Inc.
Gennum Corp.Schleifring GmbHFybr LLCStratos Lightwave, Inc.Source Photonics, Inc.TelASIC Communications, Inc.Secturion Systems, Inc.NovelSat Ltd.iniVation AGBeam Networks Ltd.Comtech AeroAstro, Inc.Raptor Oil Ltd.ROADMap Systems Ltd.