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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
International Business Machines Corp.Microsoft Corp.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Wistron Corp.ShinMaywa Industries, Ltd.Orange SATata Consultancy Services Ltd.NetEase (Hangzhou) Network Co., Ltd.Canon Electronics, Inc.Hitachi Software Engineering Co., Ltd.Hitachi Software Engineering Co., Ltd.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.NAVER Corp.NEC Soft Ltd.ThyssenKrupp Presta AGBeijing Gridsum Technology Co., Ltd.Beijing Gridsum Technology Co., Ltd.Mosaid Technologies, Inc.Power Integrations, Inc.TRUMPF Werkzeugmaschinen GmbH + Co. KGBGP, Inc.Baidu USA LLCDigimarc Corp.Asahi Techno Co., Ltd.Megvii (Beijing) Technology Co., Ltd.United Video Properties, Inc.Miracle Automation Engineering Co., Ltd.Miracle Automation Engineering Co., Ltd.
3M Innovative Properties Co.Taiwan Semiconductor Manufacturing Co., Ltd.Bayerische Motoren Werke AGJFE Holdings, Inc.Advantest Corp.NIKE, Inc.Chongqing Changan Automobile Co. Ltd.Milliken & Co. (South Carolina)Raychem Corp.Lear Corp.International Paper Co.Nanya Technology Corp.Cypress Semiconductor Corp.Varian Semiconductor Equipment Associates, Inc.Delta Faucet Co.Atlas Copco ABBrembo SpACrown Equipment Corp.Shanghai Zhenhua Heavy Industries Co., Ltd.Power Integrations, Inc.Wistron NeWeb Corp.Samsung C&T Corp.Hitachi-LG Data Storage, Inc.Jack Technology Co., Ltd.Xiamen Solex High-Tech Industries Co. Ltd.Jack Technology Co., Ltd.Xiamen Solex High-Tech Industries Co. Ltd.HMD Global OyAutodesk, Inc.FARO Technologies, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
Atmel Corp.SANYO Semiconductor Co., Ltd.Holtek Semiconductor, Inc.Foshan Blue Rocket Electronics Co., Ltd.Foshan Blue Rocket Electronics Co., Ltd.Dediprog Technology Co., Ltd.
Fremont Micro Devices Corp.Puya Semiconductor (Shanghai) Co., Ltd.Puya Semiconductor (Shanghai) Co., Ltd.