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International Business Machines Corp.Microsoft Corp.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Wistron Corp.Orange SAOrion Co., Ltd.Tata Consultancy Services Ltd.NetEase (Hangzhou) Network Co., Ltd.Hitachi Software Engineering Co., Ltd.Hitachi Software Engineering Co., Ltd.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.NAVER Corp.NEC Soft Ltd.ThyssenKrupp Presta AGBeijing Gridsum Technology Co., Ltd.Beijing Gridsum Technology Co., Ltd.Mosaid Technologies, Inc.Power Integrations, Inc.TRUMPF Werkzeugmaschinen GmbH + Co. KGBaidu USA LLCAsahi Techno Co., Ltd.Megvii (Beijing) Technology Co., Ltd.Intel Deutschland GmbHUnited Video Properties, Inc.Miracle Automation Engineering Co., Ltd.Miracle Automation Engineering Co., Ltd.Xing, Inc.Hangzhou Hikvision System Technology Co., Ltd.
Fujitsu Frontech Ltd.Feitian Technologies Co., Ltd.Nations Technologies, Inc.Gen Digital Inc.NortonLifeLock, Inc.CEC Huada Electronic Design Co., Ltd.Chaoyang University of TechnologySpectra Systems Corp.SOFTBANK BB Corp.Synthesis Electronic Technology Co., Ltd.Synthesis Electronic Technology Co., Ltd.Zwipe ASSSenstone Co., Ltd.Cross Match Technologies, Inc.CSC Jinling Shipyard Co, Ltd.DocuSign, Inc.Pindrop Security, Inc.CardinalCommerce Corp.Verifi, Inc.BOKU, Inc.myPINpad Ltd.Master Dynamic Ltd.Authentix, Inc.Thales DIS CPL USA, Inc.DSS, Inc.CX Ignited SASNok Nok Labs, Inc.XGD, Inc.Meyercord Revenue, Inc.Hierstar Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
BASF SEE.I. du Pont de Nemours & Co.EIDP, Inc.Sumitomo Chemical Co., Ltd.The Dow Chemical Co.Rohm & Haas Co.Iseki & Co., Ltd.Monsanto Co.Ajinomoto Co., Inc.Syngenta AGBell Laboratories, Inc.DowElanco Ltd.Yanmar Co., Ltd.Research Institute of Industrial Science & TechnologyMitsubishi Agricultural Machinery Co. Ltd.Stauffer Chemical Co.China Agricultural UniversityStauffer Chemical Co.Autoliv Development ABG.D. Searle LLCSyngenta Ltd.Cargill GmbHHaldor Topse A/SFujian Agriculture & Forestry UniversityUniversity of Utah Research FoundationUniversity of Utah Research FoundationRhone-Poulenc Agrochimie SAMirai Industry Co., Ltd.Gates Corp.Northeast Agricultural University
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
