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LG Electronics, Inc.Sharp Corp.Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Electronics & Telecommunications Research InstituteMotorola, Inc.Alcatel-Lucent S ANTT DOCOMO, Inc.Showa Denko Materials Co. Ltd.Western Electric Co., Inc.Fujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyLucent Technologies, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.telent Ltd.Mannesmann AGJapan Aviation Electronics Industry Ltd.SK Telecom Co., Ltd.BlackBerry Ltd.Motorola Solutions, Inc.Tokyo Electric Power Co. Holdings, Inc.
Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Motorola, Inc.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.
Microsoft Corp.Xilinx, Inc.CA Technologies, Inc.General Dynamics Corp.Yokowo Co. Ltd.Fukuvi Chemical Industry Co., Ltd.Briggs & Stratton Corp.Asahi Intecc Co., Ltd.Bombardier Recreational Products, Inc.Huizhou Desay SV Automotive Co., Ltd.Huizhou Desay SV Automotive Co., Ltd.ZF Automotive Germany GmbHWoodward, Inc.Federal-Mogul Burscheid GmbHAnalogic Corp.Gen Digital Inc.NortonLifeLock, Inc.Arcadyan Technology Corp.Nanosys, Inc.Qibu Co., Ltd.Federal-Mogul Motorparts LLCShape LLCHydrogenics Corp.The Valspar Corp.CDTi Advanced Materials, Inc.Fingerprint Cards ABSymbios, Inc.Powermat Technologies Ltd.Energy Recovery, Inc.Chassis Brakes International BV
Zhejiang Geely Holding Group Co., Ltd.Zhejiang Geely Holding Group Co., Ltd.Weidmüller Interface GmbH & Co. KGWM Motor Technology Co., Ltd.Hottinger Baldwin Messtechnik GmbHZongmu Technology (Shanghai) Co. Ltd.Zongmu Technology (Shanghai) Co. Ltd.Communications & Power Industries LLCPenny & Giles Controls Ltd.Calterah Semiconductor Technology (Shanghai) Co., Ltd.Block Engineering, Inc.Shanghai Baolong Automotive Corp.Shanghai Baolong Automotive Corp.Calterah Semiconductor Technology (Shanghai) Co., Ltd.Legerity, Inc.Uhnder, Inc.PR electronics A/SPR electronics A/STaiwan Semiconductor Co., Ltd.RedMere Technology Ltd.Eurotherm Ltd.Huayu Automotive Systems Co., Ltd.Oculii Corp.ICP DAS Co., Ltd.Anadigm, Inc.Beijing Muniu Linghang Technology Co. Ltd.Michigan Scientific Corp.Advanced Photonix, Inc.Dwyer Instruments, Inc.TMD Technologies Ltd.
telent Ltd.Schneider Electric USA, Inc.Fibocom Wireless, Inc.CAE, Inc.RGB Systems, Inc.LGS Innovations LLCNuCurrent, Inc.Beijing Mech-Mind Robotics Technologies Co., Ltd.Danobat S. Coop.WiSpry, Inc.ObjectVideo, Inc.Adam Hall GmbHSigma Additive Solutions, Inc.Element AI, Inc.Mecachrome France SASNEC Corporation of AmericaShenzhen Honglu Technology Co., Ltd.Siemens Rail Automation Pty Ltd.Prudent Energy Inc.KA Imaging, Inc.Fengtai Technology (Beijing) Co. Ltd.Kuka Systems North America LLCTongue LaboratoryWallix SARLBlue Spark Technologies, Inc.Speech Processing Solutions GmbHRockwell Collins Deutschland GmbHKuka Systems North America LLCCoronis SASOscilloquartz SA