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BlackBerry Ltd.Socionext, Inc.Macronix International Co., Ltd.Freescale Semiconductor, Inc.VIA Technologies, Inc.Unisys Corp.Broadcom Corp.Atmel Corp.British Gas Ltd.Shenzhen Polytechnic CollegeSilicon Laboratories, Inc.TYK Corp.Schweitzer Engineering Laboratories, Inc.Indesit Company SpANuvoton Technology Corp.Hitachi Industry & Control Solutions Ltd.Pilz GmbH & Co. KGHandan CollegeEVOC Intelligent Technology Co. Ltd.EVOC Intelligent Technology Co. Ltd.SCHUNK GmbH & Co. KGHoltek Semiconductor, Inc.SAGE Electrochromics, Inc.Shanghai Huahong Integrated Circuit Co., Ltd.Shanghai Huahong Integrated Circuit Co., Ltd.Stefan cel Mare University of SuceavaBaumüller Nürnberg GmbHCrestron Electronics, Inc.PTC, Inc.ATS Corp.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.
D-Wave Systems, Inc.1QB Information Technologies, Inc.Avnet, Inc.Advanced Brain Monitoring, Inc.Tenstorrent, Inc.Intel China Ltd.NeuroBlade Ltd.Hailo Technologies Ltd.Semiconductor Research Corp.Emotiv, Inc.International Computer Science InstituteInternational Computer Science InstituteXi3 Corp.ABM Industries, Inc.
Xi'an Keyway Technology Co. Ltd.Billionton Systems, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology