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Hewlett Packard Enterprise Development LPNational University of Defense TechnologyNational University of Defense TechnologyGoerTek Inc.Dongguan University of TechnologyShanghai Maritime UniversityXiamen University of TechnologyHebei University of Science & TechnologyNachi-Fujikoshi Corp.UBTECH Robotics Corp. Ltd.Zhejiang Gongshang UniversityCarnegie Mellon UniversitySoftBank Corp.Iflytek Co., Ltd.iRobot Corp.Lovely Professional UniversityKyushu Institute of TechnologyChandigarh UniversityNanchang Institute of TechnologyNational Kaohsiung University of Applied SciencesBeijing Minglue Software System Ltd.Beijing Minglue Software System Ltd.Osaka Prefecture UniversityFujifilm Dimatix, Inc.City University of Hong KongCity University of Hong KongAmyris, Inc.DeepMind Technologies Ltd.National Yunlin University of Science & TechnologyVysoká kola Bánská-Technická Univerzita Ostrava
Toyota Motor Corp.Huawei Technologies Co., Ltd.Apple, Inc.NTT DOCOMO, Inc.Fujikura Ltd.Datang Mobile Communications Equipment Co. Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.KDDI Corp.China United Network Communications Ltd.Motorola Mobility LLCNintendo Co., Ltd.Motorola Solutions Credit Co. LLCOrange SAGoerTek Inc.Deutsche Telekom AGChina Telecom Corp. Ltd.Toyo Ink SC Holdings Co. Ltd.Giesecke+Devrient GmbHWalmart LabsLear Corp.Skyworks Solutions, Inc.Chunghwa Picture Tubes Ltd.PayPal, Inc.Nanya Technology Corp.Shenzhen Royole Technologies Co., Ltd.LG Uplus Corp.Meizu Technology Co. Ltd.Snap, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AMicrosoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.Beijing Xiaomi Mobile Software Co., Ltd.Nokia Siemens Networks OySCREEN Holdings Co., Ltd.
Hitachi Ltd.LG Electronics, Inc.Toyota Motor Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.Apple, Inc.Boe Innovation Investment Co. Ltd.Google LLCHoneywell International, Inc.Xerox Holdings Corp.Bayerische Motoren Werke AGAlcatel-Lucent S ANTT DOCOMO, Inc.Renesas Electronics Corp.Dow Global Technologies LLCMicrosoft Corp.AUDI AGToshiba Lighting & Technology Corp.Toyoda Gosei Co., Ltd.Toshiba Lighting & Technology Corp.Hilti AGMediaTek, Inc.Aisin AW Co., Ltd.Boston Scientific Scimed, Inc.Advanced Micro Devices, Inc.Azbil Corp.
University of Electronic Science & Technology of ChinaBeihang UniversityBeijing Institute of TechnologySouthwest Jiaotong UniversityHarbin University of Science & TechnologyHangzhou Dianzi UniversityNational University of Defense TechnologyNational University of Defense TechnologyNanjing University of Posts & TelecommunicationsBeijing University of Posts & TelecommunicationsGuilin University of Electronic TechnologyXi'an University of Science & TechnologyWuhan University of Science & TechnologyDongguan University of TechnologyShanghai Maritime UniversityNanchang Hangkong UniversityDalian Maritime UniversityEast China Jiaotong UniversityXiamen University of TechnologyShenzhen Polytechnic CollegeZhejiang University City CollegeZhejiang University City CollegeShenyang Ligong UniversityMegaChips Corp.Naval University of EngineeringCivil Aviation University of ChinaHeilongjiang University of Science & TechnologyShanghai Second Polytechnic UniversityNanchang Institute of TechnologyEOS Srl
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.
