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LG Electronics, Inc.Sharp Corp.Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Electronics & Telecommunications Research InstituteAlcatel-Lucent S ANTT DOCOMO, Inc.Showa Denko Materials Co. Ltd.Western Electric Co., Inc.Fujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyLucent Technologies, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.telent Ltd.Mannesmann AGJapan Aviation Electronics Industry Ltd.SK Telecom Co., Ltd.BlackBerry Ltd.Motorola Solutions, Inc.Tokyo Electric Power Co. Holdings, Inc.Nubia Technology Co., Ltd.
IDEC Corp.Beckhoff Automation GmbH & Co. KGTomra Systems ASATomra Systems ASAEnterasys Networks, Inc.MOXA Technologies Co. Ltd.Hirschmann Electronics GmbHHirschmann Automation & Control GmbHTTTech Computertechnik AGBiamp Systems LLCCFT SpABeijing InHand Networks Technology Co. Ltd.Beijing InHand Networks Technology Co. Ltd.RAD Data Communications, Inc.DFI Inc.PowerDsine Ltd.Kiremko BVPlanet Technology Corp.Tailyn Technologies, Inc.Hilscher Gesellschaft für Systemautomation mbHExcelfore Corp.Sistel SRLAsante Technologies, Inc.Weed Instrument Co., Inc.Wood Group Mustang, Inc.TELDOR Cables & Systems Ltd.DYMEC, Inc.
Mesnac Co., Ltd.Beijing Tiandi Hexing Technology Co. Ltd.Beijing Tiandi Hexing Technology Co. Ltd.Fengtai Technology (Beijing) Co. Ltd.Nivis LLCQphonics GmbHCylus Cyber Security Ltd.Davicom Semiconductor, Inc.Silicon Labs Ember, Inc.Blue Pillar, Inc.DYMEC, Inc.Domosys Corp.