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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Hitachi Ltd.General Electric Co.Kubota Corp.Honeywell International, Inc.Mitsubishi Motors Corp.FANUC Corp.Yokogawa Electric Corp.KYB Corp.Azbil Corp.ULVAC, Inc.Hamilton Sundstrand Corp.The Babcock & Wilcox Co.Hitachi Plant Technologies Ltd.Aisan Industry Co., Ltd.Kobelco Construction Machinery Co. Ltd.CKD Corp.Mitsubishi Hitachi Power SystemsShenyang University of TechnologyFuji Electric Systems Co., Ltd.Johnson Electric International AGYutong Bus Co., Ltd.Yutong Bus Co., Ltd.Institute For Information IndustryNational University of Food TechnologyMitsubishi Heavy Industries Machinery Technology Corp.KEYENCE Corp.NR Electric Co., Ltd.Harman Becker Automotive Systems GmbHWrtsil Finland OyZhuzhou CRRC Times Electric Co., Ltd.
thyssenkrupp Industrial Solutions AGSMS group GmbHAlstom SASTATS ChipPAC Pte Ltd.HYUNDAI ROTEM Co.ChipMOS Technologies, Inc.MULTIVAC Sepp Haggenmüller SE & Co. KGSaipem SAChroma Ate, Inc.Mühlbauer GmbH & Co. KGHarnischfeger Corp.Ansaldo Energia SpAEd. Züblin AGBWG Bergwerk- und Walzwerk-Maschinenbau GmbHSuzhou Secote Precision Electronic Co., Ltd.Imagineering, Inc.Geico SpAClextral SASHenan Communications Planning & Design Institute Co., Ltd.Hosokawa Alpine AGHydro International Ltd.Doris Engineering SAConverteam SASLingzhi Environmental Protection Co., Ltd.Lanzhou LS Heavy Equipment Co., Ltd.Lanzhou LS Heavy Equipment Co., Ltd.Lingzhi Environmental Protection Co., Ltd.Leclanché SAMH Robot & Automation Co., Ltd.MH Robot & Automation Co., Ltd.
Samsung Electronics Co., Ltd.International Business Machines Corp.Huawei Technologies Co., Ltd.Intel Corp.Apple, Inc.Google LLCNTT DOCOMO, Inc.South China University of TechnologyMicrosoft Corp.Industrial Technology Research InstituteShanghai Jiao Tong UniversityZhejiang University of TechnologyHarbin Institute of TechnologyInventec Corp.University of Electronic Science & Technology of ChinaBeihang UniversityKunming University of Science & TechnologyMediaTek, Inc.Dalian University of TechnologyAdvanced Micro Devices, Inc.Wuhan UniversityTongji UniversityBeijing Institute of TechnologyMinolta Co., Ltd.Zhejiang Sci-Tech UniversitySouthwest Jiaotong UniversityFuzhou UniversityHarbin University of Science & TechnologySK Telecom Co., Ltd.Wisconsin Alumni Research Foundation