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Samsung Electronics Co., Ltd.Sony Group Corp.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.
National Semiconductor Corp.Atmel Corp.AVIC Jonhon Optronic Technology Co., Ltd.AVIC Jonhon Optronic Technology Co., Ltd.Qorvo US, Inc.Novuton Technology Corp. JapanSilicon Storage Technology, Inc.KMW, Inc.Anhui Tatfook Technology Co., Ltd.Smiths Group PlcTongyu Communication, Inc.Tongding Interconnection Information Co., Ltd.Speed Tech Corp.GigaLane Co., Ltd.Wolfspeed, Inc. /Old/PARTRON Co., Ltd.DEXIN Corp.AngioDynamics, Inc.RichWave Technology Corp.INPAQ Technology Co., Ltd.Sunwave Communications Co., Ltd.RF360 Europe GmbHCognitive Systems Corp.Avic Forstar S&T Co., Ltd.Wuhan Fingu Electronic Technology Co., Ltd.Jiangsu Hengxin Technology Co., Ltd.Officine di Cartigliano SpAWuhan Fingu Electronic Technology Co., Ltd.Jiangsu Hengxin Technology Co., Ltd.Resonant, Inc.