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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Sony Group Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.
Hewlett Packard Enterprise Development LPNational University of Defense TechnologyNational University of Defense TechnologyGoerTek Inc.Dongguan University of TechnologyShanghai Maritime UniversityXiamen University of TechnologyHebei University of Science & TechnologyNachi-Fujikoshi Corp.Zhejiang Gongshang UniversityCarnegie Mellon UniversitySoftBank Corp.Iflytek Co., Ltd.iRobot Corp.Lovely Professional UniversityKyushu Institute of TechnologyChandigarh UniversityNanchang Institute of TechnologyNational Kaohsiung University of Applied SciencesBeijing Minglue Software System Ltd.Beijing Minglue Software System Ltd.Osaka Prefecture UniversityFujifilm Dimatix, Inc.City University of Hong KongCity University of Hong KongAmyris, Inc.DeepMind Technologies Ltd.National Yunlin University of Science & TechnologyVysoká kola Bánská-Technická Univerzita OstravaCompugen Ltd.
Toyota Motor Corp.Honda Motor Co., Ltd.DENSO Corp.Hyundai Motor Co., Ltd.Mazda Motor Corp.Kobe Steel, Ltd.Bayerische Motoren Werke AG3M Co.Sumitomo Wiring Systems (U.S.A.), Inc.Aisin Corp.Yamaha Motor Co., Ltd.ZF Friedrichshafen AGShowa Denko Materials Co. Ltd.Resonac Corp.Mitsubishi Motors Corp.Goodyear Tire & Rubber Co.AUDI AGDaewoo Motor Co.Hitachi Metals, Ltd.Proterial Ltd.Toyota Industries Corp.Subaru Corp.The Yokohama Rubber Co., Ltd.The Yokohama Rubber Co., Ltd.BYD Co., Ltd.Subaru Corp.Zhejiang Geely Holding Group Co., Ltd.Zhejiang Geely Holding Group Co., Ltd.NGK SPARK PLUG CO., LTD.Toyoda Gosei Co., Ltd.
LAPIS Semiconductor Co. Ltd.Immersion Corp.MegaChips Corp.ams-OSRAM Asia Pacific Pte Ltd.Jabil, Inc.PMD Technologies Ltd.Melfas, Inc.Cross Match Technologies, Inc.H.P.B. Optoelectronics Co. Ltd.Oblong Industries, Inc.Hillcrest Laboratories, Inc.Sony Depthsensing Solutions SA/NVQuickLogic Corp.ArcSoft, Inc.Cipia Vision Ltd.Standing Egg, Inc.Crunchfish ABUltraleap Ltd.Photonic Sensors & Algorithms SLNanocomp Oy Ltd.Hangzhou Aixin Intelligent Technology Co., Ltd.iProov Ltd.gestigon GmbHXYZ Interactive Technologies, Inc.PrimeSense Ltd.Ineda Systems, Inc.GenieWorks, Inc.Super Node Innovation Technology Shenzhen Co. Ltd.IrisGuard UK Ltd.Seyyer, Inc.
Boe Innovation Investment Co. Ltd.Advanced Micro Devices, Inc.Chi Mei Optoelectronics Corp.Wistron Corp.Acer, Inc.Lenovo (Singapore) Pte Ltd.Digital Equipment Corp.Compal Electronics, Inc.Symbol Technologies, Inc.Pegatron Corp.Peking University Founder Group Corp.Peking University Founder Group Corp.Elecom Co., Ltd.Tonen Chemical Corp.Amotech Co., Ltd.Shenzhen Sunway Communication Co., Ltd.Lite-On IT Corp.Shenzhen Sunway Communication Co., Ltd.Belkin International, Inc.Ability Opto-Electronics Technology Co., Ltd.Control Data Corp.Suzhou Fuqiang Technology Co. Ltd.ACCO Brands Corp.Fujian Nebula Electronics Co., Ltd.First International Computer, Inc.Guangzhou Kingsons Leather Products Co. Ltd.Century Technology (Shenzhen) Co., Ltd.Dataproducts CorpShuttle, Inc.Wenger Manufacturing, Inc.
Skyhook Wireless, Inc.
AspenTech Corp.LMI Technologies, Inc.OSIsoft LLCBend Labs, Inc.Modelway Srl