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Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.BT Group PlcChina Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.China Telecom Corp. Ltd.Xilinx, Inc.Hosiden Corp.
Samsung Electronics Co., Ltd.Toyota Motor Corp.Apple, Inc.OppoNTT DOCOMO, Inc.Fujikura Ltd.Datang Mobile Communications Equipment Co. Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.KDDI Corp.China United Network Communications Ltd.Motorola Mobility LLCNintendo Co., Ltd.Motorola Solutions Credit Co. LLCOrange SAGoerTek Inc.Deutsche Telekom AGChina Telecom Corp. Ltd.Toyo Ink SC Holdings Co. Ltd.Giesecke+Devrient GmbHWalmart LabsLear Corp.Skyworks Solutions, Inc.Chunghwa Picture Tubes Ltd.PayPal, Inc.Shenzhen Royole Technologies Co., Ltd.Shenzhen Royole Technologies Co., Ltd.LG Uplus Corp.Meizu Technology Co. Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd.SEMES Co., Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Tokyo Seimitsu Co., Ltd.Siliconware Precision Industries Co., Ltd.MKS Instruments, Inc.Micronics Japan Co., Ltd.STATS ChipPAC Pte Ltd.FormFactor, Inc.ChipMOS Technologies, Inc.MPI Corp.Powertech Technology, Inc.JCET Group Co., Ltd.Namics Corp.AT & S Austria Technologie & Systemtechnik AGXintec, Inc.JAPAN ELECTRONIC MATERIALS CORP.JAPAN ELECTRONIC MATERIALS CORP.King Yuan Electronics Co., Ltd.Chipbond Technology Corp.Amkor Technology, Inc.SL Vionics Co., Ltd.NEPES Corp.Walton Advanced Engineering, Inc.Subtron Technology Co., Ltd.Foshan Nationstar Semiconductor Co., Ltd.Lingsen Precision Industries Ltd.Kinsus Interconnect Technology Corp.
Silicon Motion Technology Corp.Mellanox Technologies Ltd.MaxLinear, Inc.Micrel, Inc.OCT Circuit Technologies International Ltd.Hirschmann Car Communication GmbHAiroha Technology Corp.NeoPhotonics Corp.Dongguan Mentech Optical & Magnetic Co., Ltd.Dongguan Mentech Optical & Magnetic Co., Ltd.Echelon Corp.EnOcean GmbHAccelink Technologies Co., Ltd.Lumentum Technology UK Ltd.RAONTECH, Inc.Easylinkin Technology Co. Ltd.Baofeng Group Co., Ltd.Marvell Semiconductor, Inc.Ayar Labs, Inc.Filtronic PlcIC Plus Corp.ARTECH Co., Ltd.Mammut Sports Group AGWireless Environment LLCAurrion, Inc.Sicoya GmbHLuxtera, Inc.Peraso Technologies, Inc.Stratos Lightwave, Inc.Sonardyne International Ltd.
DENSO Corp.KYOCERA Chemical Corp.Taiwan Semiconductor Manufacturing Co., Ltd.Micron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Showa Denko Materials Co. Ltd.Resonac Corp.South China University of TechnologyEbara Corp.SCREEN Holdings Co., Ltd.University of Electronic Science & Technology of ChinaAdvanced Micro Devices, Inc.Lam Research Corp.Hangzhou Dianzi UniversitySemiconductor Components Industries LLCULVAC, Inc.JUKI Corp.Macronix International Co., Ltd.Shin-Etsu Handotai Co., Ltd.LAPIS Semiconductor Co. Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Realtek Semiconductor Corp.Fujitsu Semiconductor Ltd.DB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.Skyworks Solutions, Inc.Shenzhen Goodix Technology Co., Ltd.SMK Corp.
Electronics & Telecommunications Research InstituteYamaha Corp.JVCKenwood Corp.Semiconductor Components Industries LLCAlpine Electronics, Inc.Japan Radio Co. Ltd.Skyworks Solutions, Inc.Harman International Industries, Inc.Rohde & Schwarz GmbH & Co. KGMiyazaki Epson Corp.JOLED, Inc.Primax Electronics Ltd.Toshiba Electronic Devices & Storage Corp.Onkyo Home Entertainment Corp.Cirrus Logic, Inc.AVIC Jonhon Optronic Technology Co., Ltd.AVIC Jonhon Optronic Technology Co., Ltd.Heraeus Precious Metals GmbH & Co. KGSonos, Inc.Kitagawa Industries Co., Ltd.GTE Sylvania, Inc.GTE Sylvania, Inc.STMicroelectronics International NVNuvoton Technology Corp.DX Antenna Co., Ltd.Bang & Olufsen A/SShenzhen Topband Co., Ltd.PPC Broadband, Inc.Shenzhen Sunway Communication Co., Ltd.Shenzhen Sunway Communication Co., Ltd.
Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Toray Industries, Inc.Union Carbide Corp.Toyobo Co., Ltd.Hitachi Cable Ltd.Eastman Chemical Co.IBIDEN Co., Ltd.Unitika Ltd.Zhejiang Sci-Tech UniversityChisso Corp.China Telecom Corp. Ltd.Bekaert SANisshinbo Textile Inc.Xi'an Polytechnic UniversityTrützschler GmbH & Co. KGNikkiso Co., Ltd.Lenzing AGJNC Corp.ROCKWOOL A/SLG Information & Communications Ltd.Nichiha Corp.Buckman Laboratories International, Inc.KCC Corp.Beijing New Building Materials Public Ltd. Co.kabelmetal electro GmbHMERCURY Corp.Campagnolo SRLGE Lighting Solutions LLCLevel 3 Communications LLC
