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Hewlett-Packard Development Co.Daewoo Electronics Co. Ltd.Lenovo (Beijing) Co., Ltd.Advanced Micro Devices, Inc.NVIDIA Corp.HKC Corp. Ltd.Inspur Electronic Information Industry Co., Ltd.Digital Equipment Corp.Peking University Founder Group Corp.Peking University Founder Group Corp.Inventec (Pudong) Technology Corp.Inventec (Pudong) Technology Corp.Bunker Ramo Corp.STATS ChipPAC Pte Ltd.Fujitsu Client Computing Ltd.Compaq Computer Corp.Compaq Computer Corp.Inspur (Beijing) Electronic Information Industry Co., Ltd.Razer (Asia-Pacific) Pte. Ltd.Razer (Asia-Pacific) Pte. Ltd.Sundisk Corp.Qisda (Suzhou) Co. Ltd.Powertech Technology, Inc.Qisda (Suzhou) Co. Ltd.Getac Technology (Kunshan) Co. Ltd.Texas Instruments Deutschland GmbHGetac Technology (Kunshan) Co. Ltd.Hiyes International Co., Ltd.Control Data Corp.Silicon Integrated Systems Corp.
Fujitsu Ltd.Hewlett-Packard Development Co.Daewoo Electronics Co. Ltd.Lenovo (Beijing) Co., Ltd.Sea Chief Supply Co. Ltd.Makita Corp.HKC Corp. Ltd.Julius Blum & Co., Inc.Inspur Electronic Information Industry Co., Ltd.Emhart Industries, Inc.Emhart Industries, Inc.Digital Equipment Corp.Peking University Founder Group Corp.Paul Hettich GmbH & Co. KGSugatsune Kogyo Co., Ltd.Peking University Founder Group Corp.Autoliv ASP, Inc.Inventec (Pudong) Technology Corp.Inventec (Pudong) Technology Corp.Bunker Ramo Corp.ServiceNow, Inc.Miwa Lock Co., Ltd.U-Shin France SASAssa Abloy Ltd.Fujitsu Client Computing Ltd.Aug. Winkhaus GmbH & Co. KGCompaq Computer Corp.Compaq Computer Corp.Inspur (Beijing) Electronic Information Industry Co., Ltd.Razer (Asia-Pacific) Pte. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.Seiko Epson Corp.Intel Corp.Apple, Inc.Hewlett-Packard Development Co.Nikon Corp.Daewoo Electronics Co. Ltd.Renesas Electronics Corp.Yamaha Corp.Lenovo (Beijing) Co., Ltd.Inventec Corp.Advanced Micro Devices, Inc.Seagate Technology LLCWestern Digital Technologies, Inc.Konica Minolta Business Technologies, Inc.Renesas Technology Corp.Arçelik ASWistron Corp.NCR Corp.NEC Electronics Corp.Hon Hai Precision Industry Co., Ltd.Acer, Inc.Realtek Semiconductor Corp.Quanta Computer, Inc.Hosiden Corp.HKC Corp. Ltd.Inspur Electronic Information Industry Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BV
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology