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Ferrofluidics Corp.Ferrofluidics Corp.MagForce AGEndostart SRL
International Business Machines Corp.Fujitsu Ltd.Eastman Kodak Co.3M Co.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Beijing Xiaomi Mobile Software Co., Ltd.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Deutsche Telekom AGGemalto, Inc.Sega Group Corp.Beijing Jingdong Shangke Information Technology Co., Ltd.Beijing Jingdong Shangke Information Technology Co., Ltd.Orion Co., Ltd.LEGO A/SLEGO A/SVMware, Inc.NetEase (Hangzhou) Network Co., Ltd.Altera Corp.SK Planet Co., Ltd.Avaya, Inc.HGST, Inc.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.Nuance Communications, Inc.Sandvik AktiebolagOlivetti SpASaudi Basic Industries Corp.CA Technologies, Inc.
Koninklijke Philips NVKoninklijke Philips NVSeiko Epson Corp.E.I. du Pont de Nemours & Co.EIDP, Inc.DAIKIN INDUSTRIES Ltd.Fraunhofer-Gesellschaft eVJFE Holdings, Inc.South China University of TechnologySoutheast UniversityIndustrial Technology Research InstituteShowa Denko K.K.Resonac Holdings Corp.Shanghai Jiao Tong UniversityDIC CorporationZhejiang University of TechnologyMassachusetts Institute of TechnologyHarbin Institute of TechnologyHuazhong University of Science & TechnologyFunai Electric Co., Ltd.University of Electronic Science & Technology of ChinaKorea Advanced Institute of Science & TechnologySumitomo Bakelite Co., Ltd.Beihang UniversityKunming University of Science & TechnologyDalian University of TechnologyWuhan UniversityAmorepacific Corp.Tongji UniversityCouncil of Scientific & Industrial Research
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.
Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.