F&S Bondtec Semiconductor GmbH
Private Company
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Basic Info
Headquarter
Austria
Founded Year
1994
Social Media
http://www.fsbondtec.at
F&S Bondtec Semiconductor GmbH is a company that provides Wire bonding, Semiconductor, Construction engineering and more. F&S Bondtec Semiconductor GmbH is headquartered in Austria . F&S Bondtec Semiconductor GmbH was founded in 1994. F&S Bondtec Semiconductor GmbH has a total of 12 patents
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Data Snapshot
Patent
Innovation Word Cloud
A quick overview of tech portfolio with the top keywords and phrases extracted from patents of F&S Bondtec Semiconductor GmbH
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High Related Markets
Mentioned companies in the market reports of major market categories and sectors by F&S Bondtec Semiconductor GmbH
Market Category
Semiconductor
Market Segment
-
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Innovation Matrix
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Time Range:
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Application Domain L2
Tech Topic L2
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Subsidiaries with patent applications for F&S Bondtec Semiconductor GmbH
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F&S Bondtec Semiconductor GmbH Frequently Asked Questions
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F&S Bondtec Semiconductor GmbH manufactures wire bonding equipment. It provides gold ball, thin wire wedge, ribbon, heavy wire wedge, die bonding, and...
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Wire bonding
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