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Microsoft Corp.Xilinx, Inc.CA Technologies, Inc.Yokowo Co. Ltd.Fukuvi Chemical Industry Co., Ltd.Briggs & Stratton Corp.Asahi Intecc Co., Ltd.Bombardier Recreational Products, Inc.Huizhou Desay SV Automotive Co., Ltd.Huizhou Desay SV Automotive Co., Ltd.ZF Automotive Germany GmbHWoodward, Inc.Federal-Mogul Burscheid GmbHAnalogic Corp.Gen Digital Inc.NortonLifeLock, Inc.Arcadyan Technology Corp.Nanosys, Inc.Qibu Co., Ltd.Federal-Mogul Motorparts LLCShape LLCHydrogenics Corp.The Valspar Corp.CDTi Advanced Materials, Inc.Fingerprint Cards ABSymbios, Inc.Powermat Technologies Ltd.Energy Recovery, Inc.Chassis Brakes International BVHayes Lemmerz International, Inc.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Toshiba Chemical Corp.Kyocera Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.Electronics & Telecommunications Research Institute