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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AMicrosoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.Beijing Xiaomi Mobile Software Co., Ltd.
Hitachi Ltd.Toyota Motor Corp.Huawei Technologies Co., Ltd.Hyundai Motor Co., Ltd.Ericsson, Inc.ZTE Corp.Honeywell International, Inc.Midea Group Co. Ltd.Bayerische Motoren Werke AGNTT DOCOMO, Inc.Renesas Electronics Corp.Toyoda Gosei Co., Ltd.MediaTek, Inc.Advanced Micro Devices, Inc.Otis Elevator Co.Azbil Corp.SK Telecom Co., Ltd.BlackBerry Ltd.KDDI Corp.Deutsche Telekom AGJuniper Networks, Inc.Unisys Corp.Altera Corp.Legrand SAAtmel Corp.Cypress Semiconductor Corp.SRI InternationalShenyang Institute of AutomationTelecom Italia SpAComcast Cable Communications LLC
International Business Machines Corp.Fujitsu Ltd.Eastman Kodak Co.Google LLC3M Co.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Beijing Xiaomi Mobile Software Co., Ltd.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Deutsche Telekom AGAdobe, Inc.Gemalto, Inc.Sega Group Corp.Beijing Jingdong Shangke Information Technology Co., Ltd.Beijing Jingdong Shangke Information Technology Co., Ltd.Orion Co., Ltd.LEGO A/SLEGO A/SNetEase (Hangzhou) Network Co., Ltd.Altera Corp.SK Planet Co., Ltd.Avaya, Inc.HGST, Inc.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.Nuance Communications, Inc.Sandvik AktiebolagCA Technologies, Inc.Qizhi Software (Beijing) Co. Ltd.
Hitachi Ltd.LG Electronics, Inc.Toyota Motor Corp.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.ZTE Corp.Apple, Inc.Boe Innovation Investment Co. Ltd.Google LLCHoneywell International, Inc.Xerox Holdings Corp.Bayerische Motoren Werke AGAlcatel-Lucent S ANTT DOCOMO, Inc.Renesas Electronics Corp.Dow Global Technologies LLCMicrosoft Corp.AUDI AGToshiba Lighting & Technology Corp.Toyoda Gosei Co., Ltd.Toshiba Lighting & Technology Corp.Hilti AGMediaTek, Inc.Aisin AW Co., Ltd.Boston Scientific Scimed, Inc.Advanced Micro Devices, Inc.
Cooligy, Inc.ADTEX Inc.CloudChip, Inc.Sandensha KKReal Intent, Inc.Star bridge Systems, Inc.Dynalith Systems Co., Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd.Western Digital Technologies, Inc.Xilinx, Inc.Altera Corp.Gowin Semiconductor Corp.QuickLogic Corp.Flex Logix Technologies, Inc.Achronix Semiconductor Corp.Innovationszentrum für Telekommunikationstechnik GmbH IZTS2C, Inc.Shri Ramdeobaba College of Engineering & ManagementSilego Technology, Inc.Fachhochschule Technikum WienInstituto Superior Politecnico Jose Antonio EcheverriaM S Ramaiah School of Advanced StudiesJTAG Technologies BVIQ-Analog Corp.Université Cergy-PontoiseAcculogic, Inc.Sandensha KKReal Intent, Inc.Dynalith Systems Co., Ltd.
D.P. Technology Corp.DENTCA, Inc.OPEN MIND Technologies AGSolidCAM Ltd.Toyota Caelum, Inc.exocad GmbHCAO Group, Inc.Open Solution Co., Ltd.vhf camfacture AGVinyl Technology, Inc.Third Wave Systems, Inc.Celeritive Technologies, Inc.