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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
TRUSTEES OF THE UNIV OF PENNSYLVANIANintendo Co., Ltd.Deutsches Zentrum für Luft- und Raumfahrt e.V.Mattel, Inc.Magic Leap, Inc.LG H&H Co., Ltd.University of PittsburghNippon Sanso KKAVL List GmbHShanghai Maritime UniversityImmersion Corp.Huaiyin Institute of TechnologyGhent UniversityHitachi-GE Nuclear Energy Ltd.Sikorsky Aircraft Corp.Guangdong Polytechnic Normal UniversityUniversity of Kentucky Research FoundationSony Interactive Entertainment LLC3D Systems, Inc.Israel Aerospace Industries Ltd.Huangshan UniversityKorea University of Technology & EducationThe Ritsumeikan TrustChang Gung UniversityThe Board of Trustees of The University of AlabamaXi'an International UniversityBinder GmbHPontificia Universidad Católica de ChileLaerdal Medical ASThe Climate Corp.
Koha Co. Ltd.Togawa Rubber Co. Ltd.Consolidated Metco, Inc.FlexiDRILL Ltd.Acme Design Technology Co.Feature Integration Technology Inc.Feature Integration Technology Inc.Master SrlShanghai Shenxiling Micro-electronics Technology Co. Ltd.Pan Labs, Inc.Beijing Design Qizheng Technology Co. Ltd.Beijing Design Technology Co., Ltd.Centaur Technology, Inc.Arzeda Corp.FOMM Corp.Cyclos-Semiconductor, Inc.CombiChem, Inc.Container Components Europe Ltd.Competition Cams, Inc.Cascade Technologies Ltd.Alchip Technologies Ltd.Stuller, Inc.Scientific Environmental Design, Inc.Calabi Yau SystemsBioLeap, Inc.Red Intermediate Co. LLCRigidGlobal Design Technology SAA.F.C. Industries, Inc.Reigstad & Associates, Inc.
Fujitsu Semiconductor Ltd.DB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.Synopsys, Inc.X-FAB Semiconductor Foundries GmbHAmkor Technology, Inc.Empyrean Technology Co., Ltd.ANSYS, Inc.Aavid Thermalloy LLCZuken Ltd.Dolphin Intégration SAMagma Design Automation LLCComair Rotron, Inc.Pulsic Ltd.Jasper Design Automation, Inc.Cellixsoft Corp.Zipalog, Inc.Tellurex Corp.IOTA TechnologySilvaco, Inc.Hammond Power Solutions, Inc.Boyd Corp. (Woburn), Inc.Kooltronic, Inc.Breker Verification Systems, Inc.Daisy Systems Corp.Athena Design Systems, Inc.Valid Logic Systems, Inc.Sagantec Israel Ltd.Teklatech A/SCertess, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
