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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
Canon, Inc.Canon, Inc.Ricoh Co., Ltd.Fujifilm Business Innovation Corp.Fujifilm Business Innovation Corp.Casio Computer Co., Ltd.Fraunhofer-Gesellschaft eVOlympus Corp.Daihatsu Motor Co., Ltd.Hamamatsu Photonics KKKoito Manufacturing Co., Ltd.Minolta Co., Ltd.Nichia Corp.JSWKennametal, Inc.Hisense Visual Technology Co., Ltd.Shibaura Mechatronics Corp.Polyplastics Co., Ltd.Lite-On Technology Corp.Han's Laser Technology Industry Group Co., Ltd.Canon Electronics, Inc.Han's Laser Technology Industry Group Co., Ltd.Optoma Corp.Waymo LLCShibuya Corp.Gwangju Institute of Science & TechnologyKEYENCE Corp.Leica Geosystems AGLeica Geosystems AGShandong Normal University
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.
Alps Alpine Co., Ltd.OSRAM Opto Semiconductors GmbHRosemount, Inc.Dr. Johannes Heidenhain GmbHKeihin Corp.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.Key Safety Systems, Inc.Watlow Electric Manufacturing Co.Watlow Electric Manufacturing Co.Draeger Safety, Inc.The Toro Co.InvenSense, Inc.ifm electronic GmbHPreh GmbHPepperl+Fuchs, Inc.Methode Electronics, Inc.BorgWarner Ludwigsburg GmbHInterface, Inc.Casco Products Corp.FIGARO Engineering, Inc.Nippon Ceramic Co., Ltd.Balluff, Inc.Hanwei Electronics Group Corp.PolyIC GmbH & Co. KGTokico System Solutions Ltd.Therm-O-Disc, Inc.ISORG SAIDEX Biometrics ASAElmos Semiconductor SE
Sharp Corp.Alps Alpine Co., Ltd.Hamamatsu Photonics KKSony Semiconductor Solutions Corp.OSRAM Opto Semiconductors GmbHSemiconductor Components Industries LLCDr. Johannes Heidenhain GmbHShenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Takata, Inc.Novatek Microelectronics Corp.Keihin Corp.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.Key Safety Systems, Inc.STMicroelectronics International NVWatlow Electric Manufacturing Co.Watlow Electric Manufacturing Co.Draeger Safety, Inc.ELAN Microelectronics Corp.Preh GmbHCrucialtec Co., Ltd.Pepperl+Fuchs, Inc.Egis Technology, Inc.Methode Electronics, Inc.BorgWarner Ludwigsburg GmbHInterface, Inc.Casco Products Corp.FlexEnable Ltd.FIGARO Engineering, Inc.
Freescale Semiconductor, Inc.Rosemount, Inc.Dr. Johannes Heidenhain GmbHHarman International Industries, Inc.Takata, Inc.TEAC Corp.Nihon Dempa Kogyo Co., Ltd.Keihin Corp.Asahi Kasei Microdevices Corp.Tamagawa Seiki Co., Ltd.Yamato-Scale Co., Ltd.Key Safety Systems, Inc.CTS Corp.VACUUMSCHMELZE GmbH & Co. KGWatlow Electric Manufacturing Co.Roche Diabetes Care GmbHWatlow Electric Manufacturing Co.Draeger Safety, Inc.ifm electronic GmbHAnalogic Corp.Preh GmbHPepperl+Fuchs, Inc.Kistler Holding AGExelis, Inc.Shoei Chemical, Inc.BorgWarner Ludwigsburg GmbHInterface, Inc.Casco Products Corp.FIGARO Engineering, Inc.Sensirion AG
Alps Alpine Co., Ltd.NGK SPARK PLUG CO., LTD.OSRAM Opto Semiconductors GmbHFreescale Semiconductor, Inc.Analog Devices, Inc.DePuy Synthes Products, Inc.Keihin Corp.Asahi Kasei Microdevices Corp.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.Vega Grieshaber KGKey Safety Systems, Inc.CTS Corp.STMicroelectronics International NVWatlow Electric Manufacturing Co.Watlow Electric Manufacturing Co.Draeger Safety, Inc.Given Imaging Ltd.Preh GmbHHoriba Stec Co. Ltd.Methode Electronics, Inc.Kistler Holding AGBorgWarner Ludwigsburg GmbHOVAL Corp.Nagano Keiki Co., Ltd.Interface, Inc.Casco Products Corp.FlexEnable Ltd.Shenzhen Suteng Innovation Technology Co., Ltd.FIGARO Engineering, Inc.