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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.
Fuji Electronics Co., Ltd.Semiconductor Components Industries LLCNational Semiconductor Corp.XJ Group Corp.Zhuzhou CRRC Times Electric Co., Ltd.Zhuzhou CRRC Times Electric Co., Ltd.Gongniu Group Co., Ltd.American Superconductor Corp.Siliconix, Inc.Shinry Technologies Co., Ltd.Shenzhen Hopewind Electric Co., Ltd.Shenzhen Hopewind Electric Co., Ltd.Shenzhen Megmeet Electrical Co., Ltd.Shenzhen Megmeet Electrical Co., Ltd.Raisecom Technology Co., Ltd.Teledyne Scientific & Imaging LLCRogers Germany GmbHJohnson Matthey Catalysts (Germany) GmbHFriedrich Boysen GmbH & Co. KGPietro Fiorentini SpAZhuhai Enpower Electric Co., Ltd.Chung-Hsin Electric & Machinery Mfg. Corp.Chung-Hsin Electric & Machinery Mfg. Corp.Avnera Corp.Sejung Co., Ltd.3D Plus SASDelta Greentech (China) Co., Ltd.Pulse Engineering, Inc.Bothhand Enterprise Inc.Southchip Semiconductor Technology (Shanghai) Co., Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd.Casio Computer Co., Ltd.Micron Technology, Inc.Showa Denko K.K.Resonac Holdings Corp.Shin-Etsu Handotai Co., Ltd.Shibaura Mechatronics Corp.Advanced Semiconductor Engineering, Inc.EPISTAR Corp.Soitec SATokyo Seimitsu Co., Ltd.Atotech Deutschland GmbHVarian Semiconductor Equipment Associates, Inc.Fujimi, Inc.Siltronic AGNovuton Technology Corp. JapanZhejiang Jinko Solar Co. Ltd.FormFactor, Inc.Hirata Corp.Cymer LLCGlobalWafers Co., Ltd.Genesis Photonics, Inc.Mattson Technology, Inc.Xintec, Inc.EGing Photovoltaic Technology Co., Ltd.Xiamen San'an Optoelectronics Technology Co., Ltd.Xiamen San'an Optoelectronics Technology Co., Ltd.Fujikoshi Machinery Corp.Guilford Pharmaceuticals, Inc.Guangdong Fenghua Advanced Technology (Holding) Co., Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd.POSCO Holdings Inc.Shin-Etsu Chemical Co., Ltd.Shin-Etsu Handotai Co., Ltd.Angang Steel Co., Ltd.Shin-Etsu Polymer Co., Ltd.VIA Technologies, Inc.SUMCO Corp.Wuhan Iron & Steel Co., Ltd.Soitec SAWuhan Iron & Steel Group Corp.Fujimi, Inc.Elpida Memory, Inc.Siltronic AGPrimetals Technologies Austria GmbHElkem ASAElectro Scientific Industries, Inc.AIXTRON SENippon Steel & Sumikin Coated Sheet Corp.Inner Mongolia Baotou Steel Union Co. Ltd.Hirata Corp.LX Semicon Co., Ltd.GlobalWafers Co., Ltd.eMemory Technology, Inc.Silicon Integrated Systems Corp.Silicon Integrated Systems Corp.Faraday Technology Corp.OSAKA Titanium Technologies Co., Ltd.GigaLane Co., Ltd.Anshan Iron & Steel Group Corp.
