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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
Hitachi Ltd.LG Electronics, Inc.Toyota Motor Corp.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.Apple, Inc.ZTE Corp.Boe Innovation Investment Co. Ltd.Google LLCHoneywell International, Inc.Xerox Holdings Corp.Bayerische Motoren Werke AGAlcatel-Lucent S ANTT DOCOMO, Inc.Renesas Electronics Corp.Dow Global Technologies LLCMicrosoft Corp.AUDI AGToshiba Lighting & Technology Corp.Toyoda Gosei Co., Ltd.Toshiba Lighting & Technology Corp.Hilti AGMediaTek, Inc.Aisin AW Co., Ltd.Boston Scientific Scimed, Inc.Advanced Micro Devices, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.
Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Motorola, Inc.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Motorola Solutions, Inc.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.
MagnaChip Semiconductor Ltd.SANYO Semiconductor Co., Ltd.Allwinner Technology Co., Ltd.cynora GmbHPixtronix, Inc.Invensas Bonding Technologies, Inc.Shanghai Ciyu Information Technologies Co., Ltd.Candescent Technologies Corp.Lightmatter, Inc.PixTech, Inc.Easylinkin Technology Co. Ltd.Hangzhou Star Shuaier Electric Appliance Co., Ltd.Hangzhou Star Shuaier Electric Appliance Co., Ltd.Feature Integration Technology Inc.Feature Integration Technology Inc.AmberWave Systems Corp.Anvil TechnologyLinear Labs, Inc.Uhnder, Inc.QD Vision, Inc.Clairvoyante, Inc.Droplet Technology, Inc.ams Sensors UK Ltd.Newport Media, Inc.Shanghai Shenxiling Micro-electronics Technology Co. Ltd.Hycon Technology Corp.Bodle Technologies Ltd.Epileds Technologies, Inc.Korea Electric Power Industrial Development Co., Ltd.Neurala, Inc.
FLSmidth A/SCHIESI Farmaceutici SpAThyssenKrupp Presta AGBIAL-Portela & Cia SARECARO Aircraft Seating GmbH & Co. KGLindab ABBrennet AGFlottweg SEFlottweg SEOraMetrix, Inc.Cabinplant A/SSiemens VAI Metals Technologies GmbH & Co.Chugai Technos Corp.Innovasis, Inc.DB Regio AGEMSCHERGENOSSENSCHAFTSchüller Mbelwerk KGBisazza SpACryotherapeutics SAResonate Networks, Inc.DBI Plastics A/STrend Group SpAZytoprotec GmbHCormedics Corp.Gubra ApSTalent SrlEast West Manufacturing LLCPLH Arkitekter A/SNerve Smart Systems ApSBEKON GmbH (Delaware)
Electronics & Telecommunications Research InstituteASML Netherlands BVHyundai MicroElectronics Co., Ltd.Institute of Microelectronics of Chinese Academy of SciencesNovatek Microelectronics Corp.Beijing NAURA Microelectronics Equipment Co., Ltd.IBM United Kingdom Ltd.JOLED, Inc.Shanghai Huali Microelectronics Corp.Shanghai Huali Microelectronics Corp.Asahi Kasei Microdevices Corp.Tianma Microelectronics Co., Ltd.Wuhan Tian Ma Microelectronics Co., Ltd.Shanghai Tianma Microelectronics Co., Ltd.Xiamen Tianma Microelectronics Co., Ltd.Xiamen Tianma Microelectronics Co., Ltd.SAES Getters SpAHeraeus Precious Metals GmbH & Co. KGElectro Scientific Industries, Inc.Sanechips Technology Co., Ltd.Makino Milling Machine Co., Ltd.Mine Safety Appliances Co. LLCNuvoton Technology Corp.MPI Corp.LX Semicon Co., Ltd.Fujitsu Microelectronics, Inc.ELAN Microelectronics Corp.InvenSense, Inc.Kateeva, Inc.Raydium Semiconductor Corp.