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General Electric Co.General Electric Co.Honeywell International, Inc.The Boeing Co.Thales GroupSubaru Corp.Raytheon Co.Subaru Corp.Beihang UniversityLucas Industries PlcDaicel Corp.KYB Corp.Hughes Aircraft Co.SZ DJI Technology Co., Ltd.Raytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.BASF Corp.Hamilton Sundstrand Corp.AlliedSignal, Inc.Eclipse Aviation Corp.Tektronix, Inc.Deutsches Zentrum für Luft- und Raumfahrt e.V.United Aircraft Corp.Analog Devices, Inc.Mitsubishi Cable Industries Ltd.Voith GmbH & Co. KGaAMesserschmitt-Boelkow-Blohm GmbHMesserschmitt-Boelkow-Blohm GmbHNorthrop Grumman Systems Corp.Pratt & Whitney Canada Corp.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
Woodward, Inc.Rieker, Inc.J.C. Carter Co., Inc.Valcor Engineering Corp.GE Aviation Systems Taleris Ltd.Aero Tec Laboratories, Inc.
Meisei Electric Co., Ltd.pSemi Corp.I-O Data Device, Inc.RiT Technologies Ltd.Shanghai Emperor of Cleaning Hi-Tech Co., Ltd.Shanghai Emperor of Cleaning Hi-Tech Co., Ltd.Solid State Devices, Inc.Vision Engineering Solutions LLCAnsys Government Initiatives, Inc.
Eagle Industry Co., Ltd.Sikorsky Aircraft Corp.Woodward, Inc.Lufthansa Technik AGAurora Flight Sciences Corp.Spirit AeroSystems, Inc.Special Metals Corp.The NORDAM Group LLCInterlake Corp.American Airlines Group, Inc.AAR Corp.SGL Composites, Inc.Zolo Technologies, Inc.COI Ceramics, Inc.ASI Technology Corp.The Pratt & Whitney Co., Inc.Aero Systems Engineering, Inc.United Dynamics, Inc. (Oklahoma)Rocket Racing, Inc.Aero Tec Laboratories, Inc.
The Boeing Co.SNECMA SAChina Academy of Launch Vehicle TechnologyChina Academy of Launch Vehicle TechnologyJapan Aerospace Exploration AgencyChina Academy of Space TechnologyAirbus SASpSemi Corp.Airbus SESpace Star Technology Co., Ltd.Nishishiba Electric Co., Ltd.National Space Development Agency of JapanIndian Space Research OrganisationDaihatsu Diesel Mfg. Co., Ltd.University of BradfordBeijing Lanjian Kongjian Technology Co. Ltd.I-O Data Device, Inc.Northrop Grumman Innovation Systems, Inc.Avio SpAWorldVu Satellites Ltd.Sierra Nevada Corp.Space Exploration Technologies Corp.AST & Science LLCIMI Systems Ltd.Orbital Sciences Corp.Norinco International Cooperation Ltd.Moog Japan Ltd.RUAG Space GmbHBlue Origin LLCInmarsat Group Holdings Ltd.