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Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
DENSO Corp.KYOCERA Chemical Corp.DAIKIN INDUSTRIES Ltd.Electronics & Telecommunications Research InstituteABB Automation, Inc.Yamaha Corp.FANUC Corp.Fujitsu General Ltd.ABB Automation, Inc.Muratec Automation Co., Ltd.Yokogawa Electric Corp.Harbin Institute of TechnologyASML Netherlands BVYASKAWA Electric Corp.USM Ltd.Qingdao Haier Air Conditioner Co., Ltd.Azbil Corp.Babcock Hitachi KKAlliedSignal, Inc.Hitachi Appliances, Inc.NEC Platforms Ltd.Maschinenfabrik Rieter AGHarris Intertype Corp.Sophia Co. Ltd.Sophia Co. Ltd.Qingdao Haier Washing Machine Co., Ltd.SEMES Co., Ltd.Qingdao Haier Air Conditioning Electronics Co., Ltd.Qingdao Haier Washing Machine Co., Ltd.Analog Devices, Inc.
XJ Electric Co., Ltd.China Steel Corp.Reliance Electric Ltd.China Academy of Information & Communication TechnologyKehua Data Co., Ltd.China Academy of Information & Communication TechnologySuzhou Harmontronics Automation Technology Co., Ltd.Suzhou Harmontronics Automation Technology Co., Ltd.Giddings & Lewis, Inc.Shenzhen Dorabot, Inc.Dr. Fresh LLCTesch GmbHShenzhen Zowee Smart Manufacturing Co. Ltd.Shenzhen Zowee Smart Manufacturing Co. Ltd.Wanfeng Auto Holding Group Co., Ltd.Beet, Inc.Huaxiaxin Beijing General Processor Technology Co.Smart Manufacturing Technology Ltd.Smart Manufacturing Technology Ltd.YhdDase-Sing Packaging Technology Co. Ltd.Dodge, Inc.BCI AS
Tencent Technology (Shenzhen) Co., Ltd.Oracle America, Inc.Hewlett Packard Enterprise Development LPHeidelberger Druckmaschinen AGPraxair S.T. Technology, Inc.China Telecom Corp. Ltd.Unisys Corp.Tata Consultancy Services Ltd.Hitachi Software Engineering Co., Ltd.Hitachi Software Engineering Co., Ltd.Synopsys, Inc.NEC Soft Ltd.SAMSUNG SDS CO., LTD.The Nielsen Company (US) LLCWINCOR NIXDORF International GmbHCanon IT Solutions, Inc.NTT DATA Corp.Giesecke+Devrient Mobile Security GmbHToshiba Solutions Corp.Vtron Group Co., Ltd.3D Systems, Inc.Zhejiang Geely Commercial Vehicles Group Co. Ltd.NTT Communications Corp.Veritas Technologies LLCCOLOPL, Inc.Uchida Yoko Co., Ltd.NEC Personal Computers Ltd.Beijing Topsec Network Security Technology Co. Ltd.Hangzhou Hikvision System Technology Co., Ltd.Hangzhou Hikvision System Technology Co., Ltd.
Honeywell International, Inc.Mitsubishi Motors Corp.FANUC Corp.Toyota Industries Corp.Yokogawa Electric Corp.YASKAWA Electric Corp.Magic Leap, Inc.SRI InternationalPixArt Imaging, Inc.Nachi-Fujikoshi Corp.KEYENCE Corp.Denso Wave, Inc.Jungheinrich AGBaker Perkins Ltd.Nippon Avionics Co., Ltd.Reliance Electric Ltd.Dassault Systèmes SAM-System Co., Ltd.ifm electronic GmbHCognex Corp.Hypertherm Associates, Inc.Auris Health, Inc.The Raymond Corp.TECO Electric & Machinery Co., Ltd.Kehua Data Co., Ltd.Kollmorgen Corp.Hunan Chinasun Pharmaceutical Machinery Co., Ltd.TECO Electric & Machinery Co., Ltd.Hunan Chinasun Pharmaceutical Machinery Co., Ltd.Beckhoff Automation GmbH & Co. KG
