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Daewoo Electronics Co. Ltd.Lenovo (Beijing) Co., Ltd.Advanced Micro Devices, Inc.NVIDIA Corp.HKC Corp. Ltd.HKC Corp. Ltd.IEIT Systems Co., Ltd.Inspur Electronic Information Industry Co., Ltd.Digital Equipment Corp.Peking University Founder Group Corp.Inventec (Pudong) Technology Corp.Inventec (Pudong) Technology Corp.Bunker Ramo Corp.STATS ChipPAC Pte Ltd.Fujitsu Client Computing Ltd.Compaq Computer Corp.Compaq Computer Corp.Inspur (Beijing) Electronic Information Industry Co., Ltd.Razer (Asia-Pacific) Pte. Ltd.Razer (Asia-Pacific) Pte. Ltd.Qisda (Suzhou) Co. Ltd.Powertech Technology, Inc.Qisda (Suzhou) Co. Ltd.Getac Technology (Kunshan) Co. Ltd.Texas Instruments Deutschland GmbHGetac Technology (Kunshan) Co. Ltd.Hiyes International Co., Ltd.Control Data Corp.Silicon Integrated Systems Corp.Silicon Integrated Systems Corp.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.SK hynix, Inc.Brother Industries, Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fuji Electronics Co., Ltd.LG Display Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Kobe Steel, Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.Samsung Display Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Boe Innovation Investment Co. Ltd.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.LG Display Co., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Applied Materials, Inc.Micron Technology, Inc.Fraunhofer-Gesellschaft eVShin-Etsu Chemical Co., Ltd.TOPPAN Holdings, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.
Fujitsu Ltd.Tencent Technology (Shenzhen) Co., Ltd.Tencent Technology (Shenzhen) Co., Ltd.Yokogawa Electric Corp.Thales SAHewlett Packard Enterprise Development LPKronos Co. Ltd.Seagate Technology LLCLife Technologies Corp.Tata Consultancy Services Ltd.VMware, Inc.IEIT Systems Co., Ltd.Unisys Corp.Inspur Electronic Information Industry Co., Ltd.Avaya, Inc.MiTAC International Corp.Siemens Medical Solutions USA, Inc.Heroku, Inc.Landmark Graphics Corp.Fiberhome Telecommunication Technologies Co., Ltd.NARI Technology Co., Ltd.Shima Seiki Mfg. Ltd.Rambus, Inc.Shima Seiki Mfg. Ltd.HRL Laboratories LLCBull SANEC Soft Ltd.Peking University Founder Group Corp.Red Hat, Inc.Aisino Corp.
Intel Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Motorola, Inc.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyChina Mobile Communications Group Co., Ltd.MediaTek, Inc.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.HTC Corp.China Telecom Corp. Ltd.Nubia Technology Co., Ltd.KDDI Corp.Guangzhou Shiyuan Electronic Technology Co. Ltd.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsEricsson, Inc.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.Xilinx, Inc.Hosiden Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.General Electric Co.General Electric Co.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.FUJIFILM Corp.Apple, Inc.ZTE Corp.Samsung Display Co., Ltd.Hewlett-Packard Development Co.Google LLCEastman Kodak Co.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Oki Electric Industry Co., Ltd.Olympus Corp.Tencent Technology (Shenzhen) Co., Ltd.Motorola, Inc.TDK Corp.Alcatel-Lucent S AToyota Industries Corp.Microsoft Corp.
3M Innovative Properties Co.Eastman Kodak Co.Motorola, Inc.Panasonic Intellectual Property Corporation of AmericaUnited Microelectronics Corp.Kyoraku Sangyo KKYeda Research & Development Co. Ltd.Worldwide Specialty Property Services Pty Ltd.Worldwide Specialty Property Services Pty Ltd.Mastercard International, Inc.Purdue Research FoundationYissum Research Development Co. Ltd.Ampex Corp.IP2IPO Innovations Ltd.Palo Alto Research Center LLCRamot at Tel Aviv University Ltd.Konkuk University Industry-Academic Cooperation FoundationIntellectual Discovery Co., Ltd.Energy Conversion Devices, Inc.Appotronics Corp. Ltd.Mosaid Technologies, Inc.UCL Business Ltd.International Engine Intellectual Property Co. LLCInternational Truck Intellectual Property Co. LLCDigimarc Corp.Ansaldo Energia IP UK Ltd.Conversant Wireless Licensing SARLLongitude Licensing Ltd.Tecpharma Licensing AGMasimo Corp.