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Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
Samsung Electronics Co., Ltd.International Business Machines Corp.Huawei Technologies Co., Ltd.Intel Corp.Apple, Inc.Google LLCNTT DOCOMO, Inc.South China University of TechnologyMicrosoft Corp.Industrial Technology Research InstituteShanghai Jiao Tong UniversityZhejiang University of TechnologyHarbin Institute of TechnologyInventec Corp.University of Electronic Science & Technology of ChinaBeihang UniversityKunming University of Science & TechnologyMediaTek, Inc.Dalian University of TechnologyAdvanced Micro Devices, Inc.Wuhan UniversityTongji UniversityBeijing Institute of TechnologyMinolta Co., Ltd.Zhejiang Sci-Tech UniversitySouthwest Jiaotong UniversityFuzhou UniversityHarbin University of Science & TechnologySK Telecom Co., Ltd.Wisconsin Alumni Research Foundation
Harbin Institute of TechnologyWuhan UniversityOsaka UniversityKyushu UniversityZhejiang Gongshang UniversityThe Chinese University of Hong KongRensselaer Polytechnic InstituteThe Hong Kong Polytechnic UniversityAnqing Teachers CollegeNational Yunlin University of Science & TechnologyJapan Advanced Institute of Science & TechnologyBrunel UniversitySiemens Corporate Research, Inc.University of WollongongHwa Hsia University of TechnologyUniversity of TwenteKherson National Technical UniversityUniversity of KasselKunming Metallurgy CollegeUniversity of OregonDe Montfort UniversityTAL Education GroupLoyola University of ChicagoNational Taichung University of Science &TechnologyUniversité de Technologie de CompiègneUniversiti Teknologi MARARoyal College of ArtPortland State UniversityUniversité de Technologie de TroyesLing Tung University
International Business Machines Corp.Fujitsu Ltd.Eastman Kodak Co.Google LLCMicrosoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Beijing Xiaomi Mobile Software Co., Ltd.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Deutsche Telekom AGDeutsche Telekom AGGemalto, Inc.Sega Group Corp.Beijing Jingdong Shangke Information Technology Co., Ltd.Beijing Jingdong Shangke Information Technology Co., Ltd.Orion Co., Ltd.LEGO A/SLEGO A/SCitrix Systems, Inc.NetEase (Hangzhou) Network Co., Ltd.Altera Corp.SK Planet Co., Ltd.Avaya, Inc.HGST, Inc.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.Sandvik AktiebolagOlivetti SpASaudi Basic Industries Corp.CA Technologies, Inc.
Toshiba Tec Corp.NCR Corp.Industrial & Commercial Bank of China Ltd.Industrial & Commercial Bank of China Ltd.KOSÉ Corp.Olivetti SpAHitachi Channel Solutions, Corp.GRG Banking Equipment Co., Ltd.Diebold Self-Service SystemsTendyRon Corp.First Data Corp.LinkedIn Corp.LeCloudCashway Fintech Co., Ltd.TAKAMISAWA CYBERNETICS CO., LTD.Hebei Huijin Electromechanical Co., Ltd.SZZT Electronics Co., Ltd.Schaerer AGPricer ABShenzhen Fengchao Technology Co. Ltd.Shenzhen Fengchao Technology Co. Ltd.Inspiry Corp.Parata Systems LLCOpticon, Inc.Angelo Po Grandi Cucine SpAIER GraphicGuangzhou KingTeller Technology Co., Ltd.Guangzhou KingTeller Technology Co., Ltd.Hypercom Corp.Coupon Express, Inc.