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Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.Apple, Inc.ZTE Corp.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Motorola, Inc.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.
Huawei Technologies Co., Ltd.Intel Corp.Nippon Telegraph & Telephone Corp.HGST, Inc.CA Technologies, Inc.Bull SAIwatsu Electric Co., Ltd.Ciena Corp.Pure Storage, Inc.Leviton Manufacturing Co., Inc.Schneider Electric IT Corp.Finisar Corp.Finisar Corp.Extreme Networks, Inc.Alibaba Cloud Computing Ltd.Kehua Data Co., Ltd.Gen Digital Inc.NortonLifeLock, Inc.ECI Telecom Ltd.Inspur Software Co., Ltd.Shenzhen INVT Electric Co., Ltd.Arista Networks, Inc.Sunsea AIoT Technology Co., Ltd.Italtel SpANutanix, Inc.Panasonic Corporation of North AmericaShenzhen Envicool Technology Co., Ltd.UiPath, Inc.Dawning Information Industry Co., Ltd.OVH SAS
Samsung Electronics Co., Ltd.Canon, Inc.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.Apple, Inc.ZTE Corp.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Toppan, Inc.Konica Minolta, Inc.
Socionext, Inc.Illumina, Inc.Washington University in St. LouisThe Medical Research CouncilThe Rockefeller UniversityShanghai Institute of Materia Medica Chinese Academy of SciencesRensselaer Polytechnic InstituteUniversity of BristolVirginia Commonwealth UniversityCilag AGUniversity Of DundeeGenfit SAVectura Delivery Devices Ltd.University of NagasakiCompugen Ltd.The Jackson LaboratoryStandard BioTools, Inc.Academic Medical Center University of AmsterdamBMC Medical Co. Ltd.Universiti Sains MalaysiaThe Garvan Institute of Medical ResearchChildren's Hospital Los AngelesRaySearch Laboratories ABDalhousie UniversityThe Howard Hughes Medical InstituteNatera, Inc.Sanford Burnham Prebys Medical Discovery InstituteLa Jolla Institute for Allergy & ImmunologyMurdoch Childrens Research InstituteChroma Therapeutics Ltd.
Hewlett Packard Enterprise Development LPNVIDIA Corp.JD.com, Inc.Hangzhou H3C Technologies Co., Ltd.Lexmark International, Inc.Tata Consultancy Services Ltd.VMware, Inc.NetApp, Inc.Bull SARed Hat, Inc.British Gas Ltd.Pure Storage, Inc.NTT DATA Corp.Palantir Technologies, Inc.Altek Corp.Commvault Systems, Inc.Hangzhou Anheng Information Technology Co., Ltd.Silicon Motion Technology Corp.CETC Potevio Science & Technology Co., Ltd.Shinano Kenshi Co., Ltd.Splunk, Inc.Shinano Kenshi Co., Ltd.The MathWorks, Inc.Beijing Minglue Software System Ltd.Beijing Minglue Software System Ltd.Hengtong Optic-Electric Co., Ltd.Alibaba Cloud Computing Ltd.Infosys Ltd.Daegis, Inc.Sony Pictures Entertainment, Inc.
Hewlett Packard Enterprise Development LPNational University of Defense TechnologyNational University of Defense TechnologyGoerTek Inc.Dongguan University of TechnologyShanghai Maritime UniversityXiamen University of TechnologyHebei University of Science & TechnologyNachi-Fujikoshi Corp.Zhejiang Gongshang UniversityCarnegie Mellon UniversitySoftBank Corp.Iflytek Co., Ltd.iRobot Corp.Lovely Professional UniversityKyushu Institute of TechnologyChandigarh UniversityNanchang Institute of TechnologyNational Kaohsiung University of Applied SciencesBeijing Minglue Software System Ltd.Beijing Minglue Software System Ltd.Osaka Prefecture UniversityFujifilm Dimatix, Inc.City University of Hong KongCity University of Hong KongDeepMind Technologies Ltd.National Yunlin University of Science & TechnologyVysoká kola Bánská-Technická Univerzita OstravaCompugen Ltd.Kidde, Inc.
Hitachi Ltd.General Electric Co.State Grid Corp. of ChinaSumitomo Electric Industries Ltd.Honeywell International, Inc.Mitsubishi Motors Corp.Meidensha Corp.Osaka Gas Co., Ltd.Samsung Heavy Industries Co., Ltd.LSIS Co. Ltd.Tokyo Electric Power Co. Holdings, Inc.Nissin Electric Co., Ltd.State Grid Shanghai Municipal Electric Power Co.State Grid Shanghai Municipal Electric Power Co.Vestas Wind Systems A/STektronix, Inc.Korea Electric Power Corp.State Grid Hebei Electric Power Co.Hitachi Industrial Equipment Systems Co., Ltd.The Kansai Electric Power Co., Inc.Électricité de France SAChina Shenhua Energy Co., Ltd.Lear Corp.CGN Power Co., Ltd.Shindengen Electric Manufacturing Co. Ltd.Legrand SAHYOSUNG Corp.Nihon Dempa Kogyo Co., Ltd.Eni SpANexans SA
