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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
International Business Machines Corp.Microsoft Corp.Baidu Online Network Technology (Beijing) Co., Ltd.BlackBerry Ltd.Wistron Corp.ShinMaywa Industries, Ltd.Orange SATata Consultancy Services Ltd.NetEase (Hangzhou) Network Co., Ltd.Canon Electronics, Inc.Hitachi Software Engineering Co., Ltd.Hitachi Software Engineering Co., Ltd.Heroku, Inc.Alcatel-Lucent Shanghai Bell Co., Ltd.NEC Soft Ltd.ThyssenKrupp Presta AGBeijing Gridsum Technology Co., Ltd.Beijing Gridsum Technology Co., Ltd.Mosaid Technologies, Inc.Power Integrations, Inc.TRUMPF Werkzeugmaschinen GmbH + Co. KGBGP, Inc.Baidu USA LLCDigimarc Corp.Asahi Techno Co., Ltd.Megvii (Beijing) Technology Co., Ltd.United Video Properties, Inc.Miracle Automation Engineering Co., Ltd.Miracle Automation Engineering Co., Ltd.BioMarin Pharmaceutical, Inc.
Samsung Electronics Co., Ltd.Sony Group Corp.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.Electronics & Telecommunications Research Institute
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BV
Samsung Electronics Co., Ltd.Sony Group Corp.OppoMicron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Hamamatsu Photonics KKSony Semiconductor Solutions Corp.Semiconductor Components Industries LLCMagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Cypress Semiconductor Corp.PixArt Imaging, Inc.LARGAN Precision Co., Ltd.Novuton Technology Corp. JapanSTMicroelectronics International NVIEE International Electronics & Engineering SABYD Semiconductor Co., Ltd.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.FUJIFILM Electronic Materials USA, Inc.OFILM Group Co., Ltd.VisEra Technologies Co., Ltd.FlexEnable Ltd.PolyIC GmbH & Co. KGTeledyne Scientific & Imaging LLCISORG SAPMD Technologies Ltd.SEKONIX Co., Ltd.Artilux, Inc.SiliconFile Technologies, Inc.
Samsung Electronics Co., Ltd.Micron Technology, Inc.MagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Gentex Corp.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.Unity Opto Technology Co., Ltd.Rockley Photonics Ltd.IHP GmbH - Innovations for High Performance MicroelectronicsNational Chi Nan UniversityFoveon, Inc.MOBOTIX AGAvnera Corp.Tung Thih Electronic Co., Ltd.Skorpios Technologies, Inc.Brigates Microelectronics Inc.Tower Semiconductor Ltd.Lightmatter, Inc.Pixelplus Co., Ltd.Akustica, Inc.AmberWave Systems Corp.MEMSIC, Inc.Silicon Optronics, Inc.New Imaging Technologies SAXiroku, Inc.DecaWave Ltd.Luxtera, Inc.Tensorcom, Inc.Canesta, Inc.
MagnaChip Semiconductor Ltd.SANYO Semiconductor Co., Ltd.Allwinner Technology Co., Ltd.cynora GmbHPixtronix, Inc.Shanghai Ciyu Information Technologies Co., Ltd.Candescent Technologies Corp.PixTech, Inc.Lightmatter, Inc.Easylinkin Technology Co. Ltd.Hangzhou Star Shuaier Electric Appliance Co., Ltd.Feature Integration Technology Inc.AmberWave Systems Corp.Anvil TechnologyLinear Labs, Inc.Uhnder, Inc.Clairvoyante, Inc.Droplet Technology, Inc.ams Sensors UK Ltd.Leadis Technology, Inc.Newport Media, Inc.Bodle Technologies Ltd.Hycon Technology Corp.Epileds Technologies, Inc.Korea Electric Power Industrial Development Co., Ltd.Neurala, Inc.Arbe Robotics Ltd.Systemonic AGCorWave SARedfern Integrated Optics, Inc.
