Log In
Free Trial
Looking for inspirations for innovation challenges? Try Patsnap Eureka!
Learn More
J-Devices Corp.
Subsidiary Company
Follow
View Corporate Tree
Create Alert
Overview
Patent
Funding
Investment
Acquisition
Member
Expert
Financial
News
Basic Info
Headquarter
Oita-ken, Japan
Founded Year
1970
Employees
1,000-5,000
Social Media
http://www.j-devices.co.jp
J-Devices Corp. is a company that provides Semiconductor, Wafer, Package on package and more. J-Devices Corp. is headquartered in Japan Oita-ken. J-Devices Corp. was founded in 1970. J-Devices Corp. has a total of 75 patents
Related Topics
Semiconductor
Wafer
Package on package
Multi-chip module
Wafer-level packaging
Electronic component
System in package
RF module
Manufacturing services
Simulation
Login to view all basic info
Data Snapshot
75
Patent
16
News
4
Acquisition
Innovation Word Cloud
A quick overview of tech portfolio with the top keywords and phrases extracted from patents of J-Devices Corp.
Overall
Recent 3 years
Download
High Related Markets
Mentioned companies in the market reports of major market categories and sectors by J-Devices Corp.
Market Category
Telecommunications and Computing
Market Segment
Semiconductor
Related Company
ASE Technology Holding Co., Ltd.
United Test & Assembly Center Ltd.
[+n]
Related Market Sectors
IC Packaging Market
Out Wafer Level Packaging Patent Landscape
Download
Innovation Matrix
visualizing technology portfolio of hot application areas and blank areas for J-Devices Corp.
All Patents
Active Patents
Inactive Patents
Pending Patents
Time Range:
Overall
Overall
1 year
3 year
5 year
Application Domain L2
Application Domain L2
Application Domain L3
Application Domain L4
High-Tech Industry L1
High-Tech Industry L2
Tech Topic L2
Tech Topic L3
Timeline
Tech Topic L2
Tech Topic L2
Tech Topic L3
High-Tech Industry L1
High-Tech Industry L2
Application Domain L2
Application Domain L3
Application Domain L4
Download
Subsidiary Lists
Subsidiaries with patent applications for J-Devices Corp.
Sign up to view the full data
Free Trial Now
Download
J-Devices Corp. Frequently Asked Questions
What technical fields has J-Devices Corp. researched?
J-Devices Corp.
has researched the technical fields related to
Semiconductor
Wafer
Package on package
Multi-chip module
Wafer-level packaging
Electronic component
System in package
RF module
Manufacturing services
Simulation
What is J-Devices Corp.'s total number of patents?
J-Devices Corp.
has
75
patents in total.
How many employees does J-Devices Corp. have globally?
J-Devices Corp.
has
1001
employees worldwide.
What kind of company is J-Devices Corp.?
J-Devices Corporation, a semiconductor back-end manufacturing services company, offers wafer probing, package assembly, final testing, and package development...
What is J-Devices Corp.'s official website?
J-Devices Corp.
's official website is
http://www.j-devices.co.jp
.
Where is J-Devices Corp.'s headquarters?
J-Devices Corp.
is located in Oita-ken, Japan.
Who are J-Devices Corp. competitors?
Competitors of
J-Devices Corp.
include
ASE Technology Holding Co., Ltd.
United Test & Assembly Center Ltd.
and
Powertech Technology, Inc.
.
Show all question
Related Companies
Schneider Electric Brasil Ltda.
prüfbau Dr.-Ing.H. Dürner GmbH
Chengdu Yaguang Electronics Co., Ltd.
Caladrius Biosciences, Inc.
New Jersey, United States
Litemax Electronics, Inc.
TP, TW
Statek Corp.
California, United States
TecHarmonic, Inc.
SuperNova Optoelectronics Corp.
Topcell Solar International Co. Ltd.
Contour Optik, Inc.
Jiangsu, China
OnWafer Technologies, Inc.
California, United States
Amphenol (Changzhou) Advanced Connector Co., Ltd.
Login to view all
Hot Companies in Industries
Popular
Semiconductor
Wafer
Package on package
Multi-chip module
Wafer-level packaging
Electronic component
System in package
Shopify
Reddit
Tik tok
Apple
Squarespace
Soundcloud
Medium
Parallels
Zoom
Google
Godaddy
Microsoft
Forbes
Etsy
Huawei Technologies
Yandex
Amazon
Event brite
Dribbble
Hatena
Walmart
WPengine
Uber
Splunk
ServiceNow
Twilio
HubSpot
MuleSoft
Bloomberg
Cargill
Samsung Electronics Co., Ltd.
Canon, Inc.
Hitachi Ltd.
Fujitsu Ltd.
Sharp Corp.
SANYO Electric Co., Ltd.
Sumitomo Electric Industries Ltd.
Sumitomo Chemical Co., Ltd.
BOE Technology Group Co., Ltd.
Boe Innovation Investment Co. Ltd.
KYOCERA Chemical Corp.
Dai Nippon Printing Co., Ltd.
Kyocera Corp.
Fuji Electronics Co., Ltd.
Nikon Corp.
Oppo
Taiwan Semiconductor Manufacturing Co., Ltd.
Semiconductor Energy Laboratory Co., Ltd.
Guangzhou Bosma Optoelectronic Technology Co. Ltd.
Toppan, Inc.
Fraunhofer-Gesellschaft eV
Samsung Electro-Mechanics Co., Ltd.
AGC, Inc. (Japan)
ABB Automation, Inc.
Renesas Electronics Corp.
Shin-Etsu Chemical Co., Ltd.
Alps Alpine Co., Ltd.
Suzuki Co., Ltd.
Showa Denko Materials Co. Ltd.
South China University of Technology
Taiwan Semiconductor Manufacturing Co., Ltd.
Casio Computer Co., Ltd.
Micron Technology, Inc.
Showa Denko K.K.
Resonac Holdings Corp.
Shin-Etsu Handotai Co., Ltd.
Shibaura Mechatronics Corp.
Advanced Semiconductor Engineering, Inc.
EPISTAR Corp.
Soitec SA
Tokyo Seimitsu Co., Ltd.
Atotech Deutschland GmbH
Varian Semiconductor Equipment Associates, Inc.
Fujimi, Inc.
Siltronic AG
Novuton Technology Corp. Japan
Zhejiang Jinko Solar Co. Ltd.
FormFactor, Inc.
Hirata Corp.
Cymer LLC
GlobalWafers Co., Ltd.
Genesis Photonics, Inc.
Mattson Technology, Inc.
Xintec, Inc.
EGing Photovoltaic Technology Co., Ltd.
Xiamen San'an Optoelectronics Technology Co., Ltd.
Xiamen San'an Optoelectronics Technology Co., Ltd.
Fujikoshi Machinery Corp.
Guilford Pharmaceuticals, Inc.
Guangdong Fenghua Advanced Technology (Holding) Co., Ltd.
Semiconductor Components Industries LLC
SEMES Co., Ltd.
Shinko Electric Industries Co., Ltd.
Shinko Electric Industries Co., Ltd.
Advanced Semiconductor Engineering, Inc.
Polaris Innovations Ltd.
Siliconware Precision Industries Co., Ltd.
Qimonda AG
Powertech Technology, Inc.
JCET Group Co., Ltd.
AT & S Austria Technologie & Systemtechnik AG
Xintec, Inc.
Amkor Technology, Inc.
NEPES Corp.
HANA MICRON, Inc.
Camtek Ltd.
3D Plus SAS
Tianshui Huatian Technology Co., Ltd.
Tianshui Huatian Technology Co., Ltd.
Seoul National University
Trust Alliance Information Development Inc., Ltd. Shanghai
FlipChip International LLC
ADL Engineering, Inc.
Tera Probe, Inc.
CONNECTEC JAPAN Corp.
Palomar Technologies, Inc.
Macrotech Technology, Inc.
Macrotech Technology, Inc.
Murata Electronics North America, Inc.
GE Embedded Electronics Oy
Semiconductor Components Industries LLC
Shinko Electric Industries Co., Ltd.
Shinko Electric Industries Co., Ltd.
Synopsys, Inc.
Polaris Innovations Ltd.
Qimonda AG
ChipMOS Technologies, Inc.
Powertech Technology, Inc.
Xintec, Inc.
NEPES Corp.
Camtek Ltd.
Subtron Technology Co., Ltd.
3D Plus SAS
Tianshui Huatian Technology Co., Ltd.
Tianshui Huatian Technology Co., Ltd.
Zuken Ltd.
Seoul National University
Shanghai Meadville Science & Technology Co., Ltd.
Trust Alliance Information Development Inc., Ltd. Shanghai
FlipChip International LLC
ADL Engineering, Inc.
Tera Probe, Inc.
Macrotech Technology, Inc.
Macrotech Technology, Inc.
Silvaco, Inc.
Murata Electronics North America, Inc.
Integrated System Assemblies Corp.
Nexsem, Inc.
GE Embedded Electronics Oy
West Bond, Inc.
Taiwan Semiconductor Manufacturing Co., Ltd.
Samsung Electro-Mechanics Co., Ltd.
Semiconductor Components Industries LLC
SEMES Co., Ltd.
Shinko Electric Industries Co., Ltd.
Shinko Electric Industries Co., Ltd.
Fujitsu Semiconductor Ltd.
Advanced Semiconductor Engineering, Inc.
Siliconware Precision Industries Co., Ltd.
Qimonda AG
STATS ChipPAC Pte Ltd.
Invensas Corp.
Powertech Technology, Inc.
JCET Group Co., Ltd.
AT & S Austria Technologie & Systemtechnik AG
TongFu Microelectronics Co., Ltd.
Xintec, Inc.
King Yuan Electronics Co., Ltd.
Chipbond Technology Corp.
Amkor Technology, Inc.
NEPES Corp.
Advanced Chip Engineering Technology, Inc.
HANA MICRON, Inc.
Camtek Ltd.
3D Plus SAS
Tianshui Huatian Technology Co., Ltd.
Tianshui Huatian Technology Co., Ltd.
Micron Technology Taiwan, Inc.
Seoul National University
Trust Alliance Information Development Inc., Ltd. Shanghai
Samsung Electronics Co., Ltd.
Canon, Inc.
Fujitsu Ltd.
Sharp Corp.
SANYO Electric Co., Ltd.
Sumitomo Electric Industries Ltd.
BOE Technology Group Co., Ltd.
KYOCERA Chemical Corp.
Dai Nippon Printing Co., Ltd.
Kyocera Corp.
Fuji Electronics Co., Ltd.
Guangdong OPPO Mobile Telecommunications Corp., Ltd.
Guangdong OPPO Mobile Telecommunications Corp., Ltd.
Taiwan Semiconductor Manufacturing Co., Ltd.
Semiconductor Energy Laboratory Co., Ltd.
Guangzhou Bosma Optoelectronic Technology Co. Ltd.
Samsung Electro-Mechanics Co., Ltd.
Renesas Electronics Corp.
Shin-Etsu Chemical Co., Ltd.
Alps Alpine Co., Ltd.
Yamaha Corp.
Suzuki Co., Ltd.
Showa Denko Materials Co. Ltd.
Resonac Corp.
Sumitomo Metal Industries Ltd.
Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.
NXP Semiconductors (Thailand) Co., Ltd.
NGK SPARK PLUG CO., LTD.
NXP BV
Fraunhofer-Gesellschaft eV
Toyota Central R&D Labs, Inc.
Semiconductor Components Industries LLC
Shinko Electric Industries Co., Ltd.
Shinko Electric Industries Co., Ltd.
Advanced Semiconductor Engineering, Inc.
Polaris Innovations Ltd.
Dowa Electronics Materials Co., Ltd.
Arizona State University
Siliconware Precision Industries Co., Ltd.
Qimonda AG
Nippon Mektron Ltd.
Power Integrations, Inc.
International Rectifier Corp.
STATS ChipPAC Pte Ltd.
Nuvoton Technology Corp.
Powertech Technology, Inc.
JCET Group Co., Ltd.
eMemory Technology, Inc.
Hitachi AIC, Inc.
SANYO Semiconductor Co., Ltd.
Xintec, Inc.
Etron Technology, Inc.
Chipbond Technology Corp.
Shenzhen Sunlord Electronics Co., Ltd.
Amkor Technology, Inc.
Princo Corp.
NEPES Corp.
Xiamen San'an Integrated Circuit Co., Ltd.
Camtek Ltd.
View more
People also Viewed
Mallinckrodt Développement France company profile
Yatu Technology competitors
Camito company profile
Shanghai Datan Energy Technology competitors
Hubei Houyou Intellectual Property Service company profile
Automatic Electric competitors
WISER Systems patents
Consulting Services Support patents
Hangzhou Jingfei Optical Instrument Manufacturing company profile
Jiangsu Wanchuan Hydraulic Machinery Equipment
Potomac Aviation Technology patents
Kunming Yaolong Zhixin Transformer Manufacturing competitors
Jiangsu Entai Lighting Group patents
Seattle Espresso Machine patents
Shenzhen Dianxiaomi Network Technology
UTI patents
Priaxon competitors
Hong Kong Telecommunications competitors
Foshan Yunman Health Technology competitors
Xiangsheng Technology company profile
Guangdong Yiku Intelligent Storage Equipment Technology
Shenyang Yangzheng Industrial patents
Ningbo Zhanyi Children's Products competitors
Groupon
Shanghai Daan Medical Laboratory patents
Kvaerner Mandal patents
Ye County Quanta Aluminum company profile
Lelon Electronics competitors
Xinxiang Radiator
Anhui Pinguan Air Technology patents
Free Competitive Analysis!
Get Access
Sign up to get free competitive intelligence for millions of companies!
Page generation time: Feb 17 2023