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Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
Taiwan Semiconductor Manufacturing Co., Ltd.Casio Computer Co., Ltd.Micron Technology, Inc.Showa Denko K.K.Resonac Holdings Corp.Shin-Etsu Handotai Co., Ltd.Shibaura Mechatronics Corp.Advanced Semiconductor Engineering, Inc.EPISTAR Corp.Soitec SATokyo Seimitsu Co., Ltd.Atotech Deutschland GmbHVarian Semiconductor Equipment Associates, Inc.Fujimi, Inc.Siltronic AGNovuton Technology Corp. JapanZhejiang Jinko Solar Co. Ltd.FormFactor, Inc.Hirata Corp.Cymer LLCGlobalWafers Co., Ltd.Genesis Photonics, Inc.Mattson Technology, Inc.Xintec, Inc.EGing Photovoltaic Technology Co., Ltd.Xiamen San'an Optoelectronics Technology Co., Ltd.Xiamen San'an Optoelectronics Technology Co., Ltd.Fujikoshi Machinery Corp.Guilford Pharmaceuticals, Inc.Guangdong Fenghua Advanced Technology (Holding) Co., Ltd.
Semiconductor Components Industries LLCSEMES Co., Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Polaris Innovations Ltd.Siliconware Precision Industries Co., Ltd.Qimonda AGPowertech Technology, Inc.JCET Group Co., Ltd.AT & S Austria Technologie & Systemtechnik AGXintec, Inc.Amkor Technology, Inc.NEPES Corp.HANA MICRON, Inc.Camtek Ltd.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Seoul National UniversityTrust Alliance Information Development Inc., Ltd. ShanghaiFlipChip International LLCADL Engineering, Inc.Tera Probe, Inc.CONNECTEC JAPAN Corp.Palomar Technologies, Inc.Macrotech Technology, Inc.Macrotech Technology, Inc.Murata Electronics North America, Inc.GE Embedded Electronics Oy
Semiconductor Components Industries LLCShinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Synopsys, Inc.Polaris Innovations Ltd.Qimonda AGChipMOS Technologies, Inc.Powertech Technology, Inc.Xintec, Inc.NEPES Corp.Camtek Ltd.Subtron Technology Co., Ltd.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Zuken Ltd.Seoul National UniversityShanghai Meadville Science & Technology Co., Ltd.Trust Alliance Information Development Inc., Ltd. ShanghaiFlipChip International LLCADL Engineering, Inc.Tera Probe, Inc.Macrotech Technology, Inc.Macrotech Technology, Inc.Silvaco, Inc.Murata Electronics North America, Inc.Integrated System Assemblies Corp.Nexsem, Inc.GE Embedded Electronics OyWest Bond, Inc.
Taiwan Semiconductor Manufacturing Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Semiconductor Components Industries LLCSEMES Co., Ltd.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Fujitsu Semiconductor Ltd.Advanced Semiconductor Engineering, Inc.Siliconware Precision Industries Co., Ltd.Qimonda AGSTATS ChipPAC Pte Ltd.Invensas Corp.Powertech Technology, Inc.JCET Group Co., Ltd.AT & S Austria Technologie & Systemtechnik AGTongFu Microelectronics Co., Ltd.Xintec, Inc.King Yuan Electronics Co., Ltd.Chipbond Technology Corp.Amkor Technology, Inc.NEPES Corp.Advanced Chip Engineering Technology, Inc.HANA MICRON, Inc.Camtek Ltd.3D Plus SASTianshui Huatian Technology Co., Ltd.Tianshui Huatian Technology Co., Ltd.Micron Technology Taiwan, Inc.Seoul National UniversityTrust Alliance Information Development Inc., Ltd. Shanghai
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BV
Fraunhofer-Gesellschaft eVToyota Central R&D Labs, Inc.Semiconductor Components Industries LLCShinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Polaris Innovations Ltd.Dowa Electronics Materials Co., Ltd.Arizona State UniversitySiliconware Precision Industries Co., Ltd.Qimonda AGNippon Mektron Ltd.Power Integrations, Inc.International Rectifier Corp.STATS ChipPAC Pte Ltd.Nuvoton Technology Corp.Powertech Technology, Inc.JCET Group Co., Ltd.eMemory Technology, Inc.Hitachi AIC, Inc.SANYO Semiconductor Co., Ltd.Xintec, Inc.Etron Technology, Inc.Chipbond Technology Corp.Shenzhen Sunlord Electronics Co., Ltd.Amkor Technology, Inc.Princo Corp.NEPES Corp.Xiamen San'an Integrated Circuit Co., Ltd.Camtek Ltd.
