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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
LG Electronics, Inc.Sharp Corp.Ericsson, Inc.Nippon Telegraph & Telephone Corp.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Electronics & Telecommunications Research InstituteAlcatel-Lucent S ANTT DOCOMO, Inc.Showa Denko Materials Co. Ltd.Resonac Corp.Western Electric Co., Inc.Fujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyLucent Technologies, Inc.BT Group PlcChina Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.Mannesmann AGJapan Aviation Electronics Industry Ltd.SK Telecom Co., Ltd.BlackBerry Ltd.Motorola Solutions, Inc.Nubia Technology Co., Ltd.Nanjing University of Posts & TelecommunicationsKDDI Corp.
Electronics & Telecommunications Research InstituteASML Netherlands BVHyundai MicroElectronics Co., Ltd.Institute of Microelectronics of Chinese Academy of SciencesNovatek Microelectronics Corp.Beijing NAURA Microelectronics Equipment Co., Ltd.IBM United Kingdom Ltd.JOLED, Inc.Shanghai Huali Microelectronics Corp.Shanghai Huali Microelectronics Corp.Asahi Kasei Microdevices Corp.Tianma Microelectronics Co., Ltd.Wuhan Tian Ma Microelectronics Co., Ltd.Shanghai Tianma Microelectronics Co., Ltd.Xiamen Tianma Microelectronics Co., Ltd.Xiamen Tianma Microelectronics Co., Ltd.SAES Getters SpAHeraeus Precious Metals GmbH & Co. KGElectro Scientific Industries, Inc.Sanechips Technology Co., Ltd.Makino Milling Machine Co., Ltd.Mine Safety Appliances Co. LLCNuvoton Technology Corp.MPI Corp.LX Semicon Co., Ltd.Fujitsu Microelectronics, Inc.ELAN Microelectronics Corp.InvenSense, Inc.Kateeva, Inc.Raydium Semiconductor Corp.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.