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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.
SEMES Co., Ltd.Dowa Electronics Materials Co., Ltd.Seoul Semiconductor Co., Ltd.Institute of Electrical Engineering, Chinese Academy of SciencesInstitute of Electrical Engineering, Chinese Academy of SciencesMillerKnoll, Inc.Mattson Technology, Inc.Hitachi Power Semiconductor Device Ltd.IHP GmbH - Innovations for High Performance MicroelectronicsShinko Chemical Co. Ltd.Yangzhou Yangjie Electronic Technology Co., Ltd.Zhuzhou Smelter Group Co., Ltd.SCREEN Semiconductor Solutions Co. Ltd.Ningxia Orient Tantalum Industry Co., Ltd.Ningxia Orient Tantalum Industry Co., Ltd.Win Semiconductors Corp.Freiberger Compound Materials GmbHHenan YiCheng New Energy Co., Ltd.Chemcut Corp.United Monolithic Semiconductors SASAXT, Inc.Solyndra, Inc.Global Power Technology (Beijing) Co. Ltd.Nanosolar, Inc.Global Power Technology (Beijing) Co. Ltd.Carborundum Universal Ltd.Hunan Shuikoushan Nonferrous Metals Group Co. Ltd.Hunan Shuikoushan Nonferrous Metals Group Co. Ltd.Global Solar Energy, Inc.Nexcis SA
Soreq Nuclear Research CenterNingbo Hiper Vacuum Technology Co., Ltd.AXT, Inc.TanKeBlue Semiconductor Co., Ltd.Sri Sivasubramaniya Nadar College of EngineeringAurora Optoelectronics Co., Ltd.Acrorad Co., Ltd.GT Advanced Technologies, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.
Wolfspeed, Inc. /Old/Ningbo Hiper Vacuum Technology Co., Ltd.Monolith Semiconductor, Inc.
Renesas Electronics Corp.Semiconductor Components Industries LLCMarvell Asia Pte Ltd.Freescale Semiconductor, Inc.LAPIS Semiconductor Co. Ltd.Analog Devices, Inc.Fujitsu Semiconductor Ltd.Atmel Corp.Novatek Microelectronics Corp.Novuton Technology Corp. JapanYamaichi Electronics Co., Ltd.MegaChips Corp.STMicroelectronics International NVSilicon Storage Technology, Inc.Silicon Motion Technology Corp.Nuvoton Technology Corp.EM Microelectronic-Marin SAELAN Microelectronics Corp.Spansion Inc.Micronas GmbHeMemory Technology, Inc.Nordic Semiconductor ASASANYO Semiconductor Co., Ltd.Samtec, Inc.Samtec, Inc.Dialog Semiconductor (UK) Ltd.Alpha & Omega Semiconductor Ltd.Holtek Semiconductor, Inc.Chipsea Technologies (Shenzhen) Corp., Ltd.BitMain Technologies Holding Co.
Toppan, Inc.SCREEN Holdings Co., Ltd.Hitachi High-Tech Corp.DISCO Corp.Lam Research Corp.Advantest Corp.ULVAC, Inc.KLA Corp.SEMES Co., Ltd.Fujitsu Semiconductor Ltd.DB HITEK Co., Ltd.Tokyo Seimitsu Co., Ltd.Varian Semiconductor Equipment Associates, Inc.Siliconware Precision Industries Co., Ltd.Siltronic AGJUSUNG ENGINEERING Co., Ltd.ASML Holding NVAdvanced Micro Fabrication Equipment, Inc. ChinaAdvanced Micro Fabrication Equipment, Inc. ChinaPowertech Technology, Inc.GlobalWafers Co., Ltd.Mirae Corp.NTT Advanced Technology Corp.CMC Materials, Inc.STMicroelectronics Asia Pacific Pte Ltd.GigaLane Co., Ltd.Gebr. Schmid GmbHOkamoto Machine Tool Works, Ltd.SPTS Technologies Ltd.Chipbond Technology Corp.