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NIKE, Inc.AMF, Inc.Acushnet Co.Topgolf Callaway Brands Corp.Bridgestone Sports Co., Ltd.Mizuno Corp.SRI Sports Ltd.Dunlop Sports Co., Ltd.ASICS Corp.PUMA SEOakley, Inc.ZENOAH, Inc.CATEYE Co., Ltd.Skis Rossignol SASYETI Coolers LLCTaylor Made Golf Co., Inc.AMF, Inc.Shikoku System ProductSRAM LLCReebok International Ltd.Remington Arms Co. LLCWilson Sporting Goods Co.Hexcel Corp.Yamamoto Kogaku Co. Ltd.Polar Electro OyGiant Manufacturing Co., Ltd.Zhejiang Dafeng Industry Co., Ltd.DIRECTV LLCRed Bull GmbHRed Bull GmbH
SoftBook Press, Inc.Idilia, Inc.QMS, Inc.The British LibraryAeria, Inc.
Korean Broadcasting SystemCypress Technology Co., Ltd.CJ E&M Corp.Television Broadcasts Ltd.The Weather Channel, Inc.Mediaproducción SLCyfrowy Polsat SAiChannel io Ltd.AMC Network Entertainment LLCBrandia Mediabranding SLWestdeutscher Rundfunk Köln
Sony Group Corp.Seiko Epson Corp.Inventec Corp.Meta Platforms, Inc.Nintendo Co., Ltd.Nippon Seiki Co., Ltd.Acer, Inc.Magic Leap, Inc.Advanced Semiconductor Engineering, Inc.Immersion Corp.Snap, Inc.LARGAN Precision Co., Ltd.Siliconware Precision Industries Co., Ltd.GoPro, Inc.Silicon Motion Technology Corp.Xing, Inc.Paramount GlobalCapcom Co., Ltd.Lumus Ltd.Viewdle, Inc.MicroVision, Inc.Groupon, Inc.NCsoft Corp.Parrot SAElectronic Arts, Inc.Viaccess SAPlessey Semiconductors Ltd.Kopin Corp.Gurunavi, Inc.Suzhou Anjie Technology Co., Ltd.
Sony Group Corp.Seiko Epson Corp.Hewlett-Packard Development Co.Boe Innovation Investment Co. Ltd.Lenovo Group Ltd.Japan Display, Inc.Meta Platforms, Inc.SK Telecom Co., Ltd.Nintendo Co., Ltd.Nippon Seiki Co., Ltd.Acer, Inc.Mattel, Inc.Magic Leap, Inc.Advanced Semiconductor Engineering, Inc.Immersion Corp.LARGAN Precision Co., Ltd.Siliconware Precision Industries Co., Ltd.Samsonite IP Holdings SARLGoPro, Inc.3D Systems, Inc.COLOPL, Inc.Netflix, Inc.Paramount GlobalOnePlus Technology (Shenzhen) Co., Ltd.Alibaba Cloud Computing Ltd.Reebok International Ltd.Polar Electro OyLumus Ltd.Leia, Inc.MicroVision, Inc.
Toyota Motor Corp.Seiko Epson Corp.Honda Motor Co., Ltd.DENSO Corp.Midea Group Co. Ltd.FANUC Corp.Iseki & Co., Ltd.Hilti AGYASKAWA Electric Corp.SZ DJI Technology Co., Ltd.DAEWOO SHIPBUILDING & MARINE ENGINEERING Co., Ltd.NVIDIA Corp.JD.com, Inc.Miele & Cie. KGDana-Farber Cancer Institute, Inc.Mattel, Inc.Husqvarna ABLEGO A/SHaldor Topse A/SLEGO A/SDaihen Corp.National Aeronautics & Space AdministrationThe Shenzhen Institutes of Advanced TechnologyThe Shenzhen Institutes of Advanced TechnologyWaymo LLCSRI InternationalRyobi Ltd.Shibuya Corp.Tatsuno Corp.Nachi-Fujikoshi Corp.
Samsung Electronics Co., Ltd.International Business Machines Corp.Huawei Technologies Co., Ltd.Intel Corp.Apple, Inc.Google LLCNTT DOCOMO, Inc.South China University of TechnologyMicrosoft Corp.Industrial Technology Research InstituteShanghai Jiao Tong UniversityZhejiang University of TechnologyHarbin Institute of TechnologyUniversity of Electronic Science & Technology of ChinaBeihang UniversityKunming University of Science & TechnologyMediaTek, Inc.Dalian University of TechnologyAdvanced Micro Devices, Inc.Wuhan UniversityTongji UniversityBeijing Institute of TechnologyMinolta Co., Ltd.Zhejiang Sci-Tech UniversitySouthwest Jiaotong UniversityHarbin University of Science & TechnologySK Telecom Co., Ltd.Wisconsin Alumni Research FoundationHangzhou Dianzi UniversityChina Jiliang University
