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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.LG Electronics, Inc.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.FUJIFILM Corp.Apple, Inc.ZTE Corp.Hon Hai Precision Industry Co., Ltd.Samsung Display Co., Ltd.SK hynix, Inc.BOE Technology Group Co., Ltd.Brother Industries, Ltd.Eastman Kodak Co.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.LG Display Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Oki Electric Industry Co., Ltd.Olympus Corp.Mita Industrial Co., Ltd.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Sumitomo Electric Industries Ltd.Hon Hai Precision Industry Co., Ltd.SK hynix, Inc.Brother Industries, Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fuji Electronics Co., Ltd.LG Display Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Kobe Steel, Ltd.
Gendel Ltd.HySiLabs SASCINVENTION AGROVI Cosmetics International GmbHKTP Kunststoff Palettentechnik GmbHRegeronInduchem AGSIAG Schaaf Industrie AGtubus carrier systems GmbHDaifuku Logan Ltd.Inkra Networks Corp.
DEXIN Corp.Pulse-Link, Inc.Nanotron Technologies GmbHDigital Global Systems, Inc.DecaWave Ltd.FRTEK Co., Ltd.Alereon, Inc.HUBER+SUHNER Cube Optics AGTaiwan Mobile Co., Ltd.Zinwave Ltd.Physical Devices, Inc.Hydrason Solutions Ltd.CRFS Ltd.Broadlogic Network Technologies, Inc.Adeptence LLCTsujiko Co., Ltd.COJOT OySaint Lawrence Communications LLCEmpower RF Systems, Inc.Aviacomm, Inc.S2 Corp.Anadigics, Inc.EpiSys Science, Inc.InnoWave ECI Wireless Systems LtdIgnion SLEngim, Inc.Wireless Power Amplifier Module, Inc.
CETC Cyberspace Security Technology Co., Ltd.Iridian Technologies, Inc.Accipiter Radar Technologies, Inc.Legrand Colombia SAHarris IT Services Corp.VehicleSense, Inc.Pelmorex Corp.Thinkstream, Inc.Tohoku Information Systems Co., Inc.
LG Electronics, Inc.Sharp Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Oki Electric Industry Co., Ltd.Electronics & Telecommunications Research InstituteMotorola, Inc.NTT DOCOMO, Inc.Alcatel-Lucent S AShowa Denko Materials Co. Ltd.Western Electric Co., Inc.vivo Mobile Communication Co., Ltd.Resonac Corp.Fujikura Ltd.Hitachi Metals, Ltd.Nokia Siemens Networks OyChina Mobile Communications Group Co., Ltd.Lucent Technologies, Inc.China Mobile Communications Group Co., Ltd.Mannesmann AGJapan Aviation Electronics Industry Ltd.SK Telecom Co., Ltd.BlackBerry Ltd.Orange SAChina United Network Communications Group Co., Ltd.Huawei Device Co., Ltd.China Telecom Corp. Ltd.
Intel Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Motorola, Inc.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyChina Mobile Communications Group Co., Ltd.MediaTek, Inc.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.HTC Corp.China Telecom Corp. Ltd.Nubia Technology Co., Ltd.KDDI Corp.Guangzhou Shiyuan Electronic Technology Co. Ltd.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsEricsson, Inc.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.Hosiden Corp.Microchip Technology, Inc.