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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVAGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.
Boe Innovation Investment Co. Ltd.Honeywell International, Inc.Thales GroupAlps Alpine Co., Ltd.Raytheon Co.NGK SPARK PLUG CO., LTD.Hamamatsu Photonics KKRaytheon Technologies Corp.Japan Aviation Electronics Industry Ltd.OSRAM Opto Semiconductors GmbHNippon Seiki Co., Ltd.LAPIS Semiconductor Co. Ltd.HELLA GmbH & Co. KGaAAnalog Devices, Inc.DePuy Synthes Products, Inc.Rosemount, Inc.Dr. Johannes Heidenhain GmbHThe Georgia Tech Research Corp.Shenzhen Goodix Technology Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Furuno Electric Co., Ltd.Novatek Microelectronics Corp.Asahi Kasei Microdevices Corp.Meizu Technology Co. Ltd.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.KEYENCE Corp.Weidmüller Interface GmbH & Co. KGPiaggio & C SpAB/E Aerospace, Inc.
Samsung Electronics Co., Ltd.Sony Group Corp.LG Electronics, Inc.General Electric Co.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.Electronics & Telecommunications Research Institute
Samsung Electronics Co., Ltd.Micron Technology, Inc.MagnaChip Semiconductor Ltd.DB HITEK Co., Ltd.Gentex Corp.Huaian Imaging Device Manufacturer Corp.Huaian Imaging Device Manufacturer Corp.Unity Opto Technology Co., Ltd.Rockley Photonics Ltd.IHP GmbH - Innovations for High Performance MicroelectronicsInvensas Bonding Technologies, Inc.National Chi Nan UniversityFoveon, Inc.MOBOTIX AGAvnera Corp.Tung Thih Electronic Co., Ltd.Skorpios Technologies, Inc.Brigates Microelectronics Inc.Lightmatter, Inc.Pixelplus Co., Ltd.Akustica, Inc.AmberWave Systems Corp.Silicon Optronics, Inc.New Imaging Technologies SAXiroku, Inc.DecaWave Ltd.Luxtera, Inc.Tensorcom, Inc.Canesta, Inc.ams Sensors UK Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Seiko Epson Corp.Apple, Inc.Hewlett-Packard Development Co.Nikon Corp.Daewoo Electronics Co. Ltd.Renesas Electronics Corp.Yamaha Corp.Lenovo Group Ltd.Lenovo (Beijing) Co., Ltd.Advanced Micro Devices, Inc.Seagate Technology LLCWestern Digital Technologies, Inc.Konica Minolta Business Technologies, Inc.Renesas Technology Corp.Arçelik ASWistron Corp.NEC Electronics Corp.Hon Hai Precision Industry Co., Ltd.Acer, Inc.Quanta Computer, Inc.HKC Corp. Ltd.Inspur Electronic Information Industry Co., Ltd.Shenzhen Goodix Technology Co., Ltd.Lite-On Technology Corp.Lenovo (Singapore) Pte Ltd.Pilot Corp.
Alps Alpine Co., Ltd.NGK SPARK PLUG CO., LTD.Freescale Semiconductor, Inc.Analog Devices, Inc.Broadcom Corp.Rosemount, Inc.Dr. Johannes Heidenhain GmbHTakata, Inc.Continental Automotive Electronics LLCKeihin Corp.Asahi Kasei Microsystems Co., Ltd.Asahi Kasei Microdevices Corp.PixArt Imaging, Inc.Tamagawa Seiki Co., Ltd.Safran SAKey Safety Systems, Inc.CTS Corp.Allegro MicroSystems LLCPacific Industrial Co., Ltd.Trimble Navigation Ltd.Watlow Electric Manufacturing Co.Watlow Electric Manufacturing Co.Draeger Safety, Inc.InvenSense, Inc.ifm electronic GmbHCognex Corp.Preh GmbHPepperl+Fuchs, Inc.Methode Electronics, Inc.Kistler Holding AG
Alps Alpine Co., Ltd.LAPIS Semiconductor Co. Ltd.Analog Devices, Inc.Rosemount, Inc.Dr. Johannes Heidenhain GmbHThe Georgia Tech Research Corp.Takata, Inc.Nihon Dempa Kogyo Co., Ltd.Asahi Kasei Microdevices Corp.Tamagawa Seiki Co., Ltd.The Charles Stark Draper Laboratory, Inc.Key Safety Systems, Inc.Allegro MicroSystems LLCWatlow Electric Manufacturing Co.Watlow Electric Manufacturing Co.Draeger Safety, Inc.InvenSense, Inc.Preh GmbHPepperl+Fuchs, Inc.Solar Light Co., LLC.Kistler Holding AGBorgWarner Ludwigsburg GmbHInterface, Inc.Sitronix Technology Corp.Casco Products Corp.FIGARO Engineering, Inc.MultiDimension Technology Co. Ltd.Sensirion AGNippon Ceramic Co., Ltd.Tactual Labs Co.
